10CX150YF780E5G
| Part Description |
Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 284 10907648 150000 780-BBGA, FCBGA |
|---|---|
| Quantity | 302 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 284 | Voltage | 900 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 54770 | Number of Logic Elements/Cells | 150000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10907648 |
Overview of 10CX150YF780E5G – Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 284 10907648 150000 780-BBGA, FCBGA
The 10CX150YF780E5G is a Cyclone® 10 GX Field Programmable Gate Array (FPGA) from Intel, provided in an extended-grade speed option. It delivers a high-density programmable fabric with 150,000 logic elements and 10,907,648 bits of on-chip RAM for complex digital designs.
Designed as a surface-mount FCBGA device (780-ball / 29 × 29 FBGA footprint), this part offers 284 user I/Os and a specified supply voltage of 900 mV, with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
Key Features
- Logic Capacity — 150,000 logic elements, enabling substantial digital integration for medium- to high-density designs.
- Embedded Memory — 10,907,648 total RAM bits to support on-chip buffering, state storage, and memory-intensive functions.
- I/O Count — 284 available I/Os for broad peripheral interfacing and system connectivity.
- Package & Mounting — 780-BBGA FCBGA package (supplier package: 780-FBGA, FC 29×29) in a surface-mount form factor for compact board integration.
- Voltage Supply — Device specified at a 900 mV supply.
- Temperature & Grade — Extended grade (-E5), rated for operation from 0 °C to 100 °C.
- Compliance — RoHS compliant.
Unique Advantages
- High integration density: 150,000 logic elements reduce external component needs by consolidating logic on-chip.
- Substantial on-chip memory: Nearly 11 Mb of RAM bits supports larger buffering, lookup tables, and embedded data storage without external memory.
- Generous I/O resources: 284 I/Os enable flexible interfacing with sensors, peripherals, and system buses.
- Compact BGA footprint: 780-ball FCBGA (29 × 29) enables dense PCB layouts while maintaining a surface-mount assembly flow.
- Extended-grade operating range: Rated 0 °C to 100 °C for applications requiring extended-temperature operation.
- Regulatory compliance: RoHS status ensures material compliance for modern manufacturing requirements.
Why Choose 10CX150YF780E5G?
The 10CX150YF780E5G positions itself as a high-capacity, extended-grade Cyclone® 10 GX FPGA option for designs that require a large programmable fabric, significant on-chip RAM, and extensive I/O within a compact BGA package. Its combination of 150,000 logic elements, 10,907,648 RAM bits, and 284 I/Os makes it suitable for complex digital systems where integration density and board space are important considerations.
Backed by Intel's Cyclone 10 GX family documentation and available in the -E5 extended speed grade, this device offers a clear specification set—voltage, thermal range, package, and compliance—helpful for procurement and system-level planning.
Request a quote or submit a purchase inquiry to receive pricing and availability for the 10CX150YF780E5G.
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