10CX150YF672E6G

The 10CX150YF672E6G is an Intel Cyclone® 10 GX FPGA in an extended grade offering. It provides 150,000 logic elements, 10,907,648 bits of on-chip RAM, and 236 I/O in a 672‑ball BGA footprint for surface‑mount assembly.

The device is delivered as an extended‑grade Cyclone 10 GX device and is supported by comprehensive documentation covering electrical characteristics, switching and transceiver performance, configuration timing, and I/O timing to assist design and integration.

Key Features

• Core capacity — 150,000 logic elements to implement complex programmable logic and custom hardware functions.
• On‑chip memory — 10,907,648 total RAM bits to support data buffering, FIFOs, and local storage for logic acceleration.
• I/O count — 236 general I/O pins to interface with peripherals, memory, and system buses.
• Package & mounting — 672‑BBGA FCBGA package (supplier package listed as 672‑FBGA, FC 27×27) designed for surface‑mount PCB assembly.
• Power — Voltage supply listed at 900 mV for core power planning.
• Operating range — Rated for 0 °C to 100 °C operating temperature.
• Grade & compliance — Extended grade device; RoHS compliant.
• Documentation — Datasheet coverage includes operating conditions, switching characteristics, transceiver and periphery specifications, configuration timing, and I/O timing to support system validation.

Typical Applications

• Custom logic and prototyping — Implement complex, large‑scale programmable logic using 150,000 logic elements and substantial on‑chip RAM for rapid hardware iteration.
• Embedded system control — Integrate control logic and interfaces with 236 I/O for sensors, actuators, and system peripherals.
• High‑density interface bridging — Use the abundant I/O and on‑chip memory to bridge high‑pin‑count interfaces and buffer data streams.

Unique Advantages

• High logic density: 150,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing overall BOM and board area.
• Large on‑chip RAM: Nearly 11 million bits of RAM support deep buffering and local data storage to improve throughput and reduce external memory dependency.
• Generous I/O: 236 I/O pins provide flexibility for complex interface requirements without additional I/O expanders.
• Surface‑mount 672‑BBGA packaging: A compact package option that supports high pin counts while maintaining a small PCB footprint.
• Extended temperature rating: 0 °C to 100 °C operating range suited to a broad set of commercial and industrial ambient conditions.
• Standards compliance: RoHS compliance simplifies regulatory and manufacturing planning.

Why Choose 10CX150YF672E6G?

The 10CX150YF672E6G combines high logic capacity, substantial on‑chip memory, and a large I/O complement in a compact 672‑ball BGA package, making it a practical choice for designers who need significant programmable resources in a surface‑mount form factor. Its extended grade designation and comprehensive datasheet information help streamline electrical integration and timing validation.

This part is suitable for projects that require consolidation of multiple digital functions, local data buffering, and flexible interfacing while benefiting from Intel's Cyclone 10 GX device documentation for configuration and performance guidance.

Request a quote or submit a sales inquiry for pricing and availability for the 10CX150YF672E6G. Our team can provide lead‑time and ordering details to support your design schedule.