10CX150YF780E6G

The Intel Cyclone® 10 GX Field Programmable Gate Array (FPGA) 10CX150YF780E6G is a high-density programmable logic device that provides 150,000 logic elements, 10,907,648 bits of on-chip RAM and 284 user I/Os in a compact 780-ball BGA package. This Extended-grade (-E6) device is specified with electrical and configuration characteristics documented in the device datasheet, making it suitable for designers requiring verified programmable logic capacity and on-chip memory within a surface-mount FCBGA package.

Key Features

• Logic Capacity  150,000 logic elements (cells) to implement complex programmable logic and custom digital functions.
• On-chip Memory  10,907,648 total RAM bits for embedded data buffering, state storage and memory-mapped logic structures.
• I/O Resources  284 user I/O pins to support broad peripheral interfacing and board-level connectivity.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-FBGA, FC (29×29). Mounting type: surface mount.
• Grade & Speed  Extended grade device offered in the -E6 speed grade, as identified in the product designation.
• Power & Thermal  Voltage supply listed as 900 mV; operating temperature range 0 °C to 100 °C as specified for this device.
• Regulatory  RoHS compliant.
• Documented Electrical & Configuration Details  Device datasheet provides comprehensive sections for electrical characteristics, switching characteristics, configuration timing and I/O timing.

Unique Advantages

• High programmable density: 150,000 logic elements enable migration of complex algorithms and multiple IP blocks into a single FPGA device.
• Substantial on-chip RAM: Over 10.9 million bits of RAM reduce external memory dependence for many buffering and state-storage needs.
• Generous I/O count: 284 I/Os allow flexible board-level connectivity and support for numerous peripheral interfaces.
• Compact FCBGA footprint: 780-ball BGA (29×29) minimizes PCB area while delivering high pin count and signal routing density.
• Extended-grade reliability: Extended grade (-E6) designation and specified 0 °C to 100 °C operating range provide predictable behavior across typical commercial-embedded environments.
• Standards-aligned compliance: RoHS compliance supports regulatory and environmental requirements for assemblies and supply chains.

Why Choose 10CX150YF780E6G?

The 10CX150YF780E6G positions itself as a high-density Cyclone® 10 GX FPGA offering significant on-chip logic and RAM in a compact, surface-mount FCBGA package. Its combination of 150,000 logic elements, more than 10.9 Mbits of RAM and 284 I/Os addresses designs that require consolidated programmable logic capacity with substantial embedded memory and flexible I/O.

Engineers and procurement teams seeking a documented, Extended-grade Intel Cyclone 10 GX device with published electrical, switching and configuration specifications will find this part suited to scalable digital designs where PCB area, logic capacity and on-chip resources are key selection criteria.

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