10CX105YU484I6G
| Part Description |
Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 8641536 104000 484-BFBGA |
|---|---|
| Quantity | 1,223 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA | Number of I/O | 188 | Voltage | 900 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38000 | Number of Logic Elements/Cells | 104000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.0001 | ||
| Qualification | N/A | Total RAM Bits | 8641536 |
Overview of 10CX105YU484I6G – Cyclone® 10 GX FPGA, 104000 logic elements
The 10CX105YU484I6G is an Intel Cyclone® 10 GX Field Programmable Gate Array (FPGA) offered in an industrial grade. This device provides 104,000 logic elements and 8,641,536 bits of on-chip RAM in a compact 484-BFBGA (484-UBGA, 19×19) package, and supports 188 I/O pins for flexible system integration.
With a 0.9 V core supply and a specified operating temperature range of −40 °C to 100 °C, the device is targeted at industrial applications that require significant logic density, large embedded memory, and robust temperature tolerance.
Key Features
- Logic Capacity 104,000 logic elements enable complex digital designs and high-density logic implementation.
- Embedded Memory Total on-chip RAM of 8,641,536 bits supports memory-intensive functions and buffering without external SRAM.
- I/O Count 188 general-purpose I/O pins provide broad interface capability for peripherals, sensors, and system buses.
- Package 484-BFBGA (supplier package: 484-UBGA, 19×19) delivers a high-pin-count, compact footprint suitable for surface-mount PCB assembly.
- Power Core voltage specified at 900 mV simplifies power budgeting for the FPGA fabric.
- Temperature Range Industrial operating temperature from −40 °C to 100 °C for deployment in thermally challenging environments.
- Mounting and Compliance Surface-mount package with RoHS compliance for modern manufacturing and regulatory requirements.
Typical Applications
- Industrial Control and Automation Industrial-grade temperature rating and high logic density make the device suitable for programmable control, motion control, and industrial communication nodes.
- High-Density Logic Systems Large logic element count supports complex signal processing, protocol handling, and custom hardware acceleration.
- Memory-Intensive Designs 8.64 Mbit of embedded RAM enables buffering, packet handling, and large on-chip data structures without immediate reliance on external memory.
- Multi-I/O Interfaces 188 I/Os allow the FPGA to serve as a central hub for sensor aggregation, peripheral control, and heterogeneous interface bridging.
Unique Advantages
- High Logic Density: 104,000 logic elements provide the capacity to implement complex, integrated digital systems on a single device.
- Substantial On-Chip RAM: 8,641,536 bits of RAM reduce dependence on external memory for many buffering and storage tasks.
- Industrial Temperature Capability: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
- Compact High-Pin Package: 484-BFBGA (19×19) balances a small PCB footprint with a high I/O count for dense system layouts.
- Low-Voltage Core: 900 mV core supply simplifies power-rail planning for the FPGA fabric.
- RoHS Compliant: Meets lead-free manufacturing requirements for modern production flows.
Why Choose 10CX105YU484I6G?
The 10CX105YU484I6G positions itself as a high-capacity, industrial-grade FPGA that combines substantial logic resources with large on-chip RAM and a generous I/O complement in a compact BFBGA footprint. These characteristics make it well suited for embedded and industrial designs that require integration of complex logic, substantial buffering, and reliable operation across a wide temperature range.
Engineers specifying this device benefit from a clear set of verifiable hardware attributes—logic element count, RAM size, I/O count, package, core voltage, and industrial temperature rating—allowing straightforward system-level trade-offs for performance, integration, and environmental robustness.
Request a quote or submit a pricing inquiry to learn more about availability and lead times for the 10CX105YU484I6G.

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