10CX105YU484I6G

IC FPGA 188 I/O 484UBGA
Part Description

Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 8641536 104000 484-BFBGA

Quantity 1,223 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BFBGANumber of I/O188Voltage900 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38000Number of Logic Elements/Cells104000
Number of GatesN/AECCNEAR99HTS Code8542.31.0001
QualificationN/ATotal RAM Bits8641536

Overview of 10CX105YU484I6G – Cyclone® 10 GX FPGA, 104000 logic elements

The 10CX105YU484I6G is an Intel Cyclone® 10 GX Field Programmable Gate Array (FPGA) offered in an industrial grade. This device provides 104,000 logic elements and 8,641,536 bits of on-chip RAM in a compact 484-BFBGA (484-UBGA, 19×19) package, and supports 188 I/O pins for flexible system integration.

With a 0.9 V core supply and a specified operating temperature range of −40 °C to 100 °C, the device is targeted at industrial applications that require significant logic density, large embedded memory, and robust temperature tolerance.

Key Features

  • Logic Capacity  104,000 logic elements enable complex digital designs and high-density logic implementation.
  • Embedded Memory  Total on-chip RAM of 8,641,536 bits supports memory-intensive functions and buffering without external SRAM.
  • I/O Count  188 general-purpose I/O pins provide broad interface capability for peripherals, sensors, and system buses.
  • Package  484-BFBGA (supplier package: 484-UBGA, 19×19) delivers a high-pin-count, compact footprint suitable for surface-mount PCB assembly.
  • Power  Core voltage specified at 900 mV simplifies power budgeting for the FPGA fabric.
  • Temperature Range  Industrial operating temperature from −40 °C to 100 °C for deployment in thermally challenging environments.
  • Mounting and Compliance  Surface-mount package with RoHS compliance for modern manufacturing and regulatory requirements.

Typical Applications

  • Industrial Control and Automation  Industrial-grade temperature rating and high logic density make the device suitable for programmable control, motion control, and industrial communication nodes.
  • High-Density Logic Systems  Large logic element count supports complex signal processing, protocol handling, and custom hardware acceleration.
  • Memory-Intensive Designs  8.64 Mbit of embedded RAM enables buffering, packet handling, and large on-chip data structures without immediate reliance on external memory.
  • Multi-I/O Interfaces  188 I/Os allow the FPGA to serve as a central hub for sensor aggregation, peripheral control, and heterogeneous interface bridging.

Unique Advantages

  • High Logic Density: 104,000 logic elements provide the capacity to implement complex, integrated digital systems on a single device.
  • Substantial On-Chip RAM: 8,641,536 bits of RAM reduce dependence on external memory for many buffering and storage tasks.
  • Industrial Temperature Capability: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
  • Compact High-Pin Package: 484-BFBGA (19×19) balances a small PCB footprint with a high I/O count for dense system layouts.
  • Low-Voltage Core: 900 mV core supply simplifies power-rail planning for the FPGA fabric.
  • RoHS Compliant: Meets lead-free manufacturing requirements for modern production flows.

Why Choose 10CX105YU484I6G?

The 10CX105YU484I6G positions itself as a high-capacity, industrial-grade FPGA that combines substantial logic resources with large on-chip RAM and a generous I/O complement in a compact BFBGA footprint. These characteristics make it well suited for embedded and industrial designs that require integration of complex logic, substantial buffering, and reliable operation across a wide temperature range.

Engineers specifying this device benefit from a clear set of verifiable hardware attributes—logic element count, RAM size, I/O count, package, core voltage, and industrial temperature rating—allowing straightforward system-level trade-offs for performance, integration, and environmental robustness.

Request a quote or submit a pricing inquiry to learn more about availability and lead times for the 10CX105YU484I6G.

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