10M02SCU169C8G

IC FPGA 130 I/O 169UBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 130 110592 2000 169-LFBGA

Quantity 947 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package169-UBGA (11x11)GradeCommercialOperating Temperature0°C – 85°C
Package / Case169-LFBGANumber of I/O130Voltage2.85 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs125Number of Logic Elements/Cells2000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of 10M02SCU169C8G – MAX® 10 FPGA, 2000 Logic Elements, 169-LFBGA

The 10M02SCU169C8G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 169‑LFBGA package. It is a commercial‑grade, surface‑mount programmable logic device offering a balance of logic capacity, on‑chip RAM, and I/O for embedded and commercial electronic designs.

Designed for applications that require reconfigurable hardware, the device combines 2,000 logic elements with 110,592 total RAM bits and 130 I/O pins, while operating from a 2.85 V to 3.465 V supply and a 0 °C to 85 °C temperature range.

Key Features

  • Logic Capacity  2,000 logic elements organized across 125 logic blocks, providing a compact programmable fabric for control, glue logic, and custom datapath functions.
  • On‑chip Memory  110,592 total RAM bits available for buffering, FIFOs, and small on‑chip data storage needs.
  • I/O and Package  130 I/O pins in a 169‑LFBGA package (supplier package: 169‑UBGA, 11×11), surface‑mount mounting for compact board layouts.
  • Power  Operates from a 2.85 V to 3.465 V supply range to match common commercial power rails.
  • Operating Range & Grade  Commercial device with an operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS‑compliant for environmentally conscious product designs.

Unique Advantages

  • Compact, high‑pin package: The 169‑LFBGA (169‑UBGA, 11×11) delivers 130 I/O in a small surface‑mount footprint, helping reduce board area for dense designs.
  • Balanced logic and memory: 2,000 logic elements paired with 110,592 RAM bits supports mixed control and data‑buffering tasks without external memory for small to medium complexity functions.
  • Commercial temperature and supply compatibility: Specified for 0 °C to 85 °C and a 2.85 V–3.465 V supply range, simplifying integration into commercial systems using standard rails.
  • RoHS compliance: Meets lead‑free and restricted‑substance requirements for global commercial product assemblies.
  • Surface‑mount assembly: 169‑LFBGA surface‑mount packaging suits automated assembly and standard PCB manufacturing processes.

Why Choose 10M02SCU169C8G?

The 10M02SCU169C8G is positioned for commercial designs that need a compact, programmable logic solution with a moderate logic element count, substantial on‑chip RAM, and a high I/O count in a small BGA package. Its electrical and thermal specifications make it suitable for embedded applications where RoHS compliance and surface‑mount assembly are required.

Choose this FPGA when you need a verified combination of logic, memory, and I/O in a single device to reduce component count and simplify board design while maintaining predictable operating and supply parameters.

Request a quote or submit an inquiry to check availability and pricing for 10M02SCU169C8G.

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