10M04DAF256A7G

The 10M04DAF256A7G is an Intel MAX® 10 field-programmable gate array (FPGA) in a 256-LBGA package. It provides a mid-range logic density with on-chip memory and a high I/O count targeted at embedded and automotive applications.

Designed for systems that require reconfigurable logic with defined operating conditions, this device offers a 1.15–1.25 V core supply range, 193,536 total RAM bits, 4,000 logic elements, and an operating temperature range of –40 °C to 125 °C. It carries AEC‑Q100 qualification for automotive usage.

Key Features

• Logic Capacity — 4,000 logic elements to implement mid-density programmable logic and glue‑logic functions.
• On‑chip Memory — 193,536 total RAM bits for embedded data buffering, lookup tables, and small FIFOs.
• I/O Resources — 178 I/O pins to support multiple interfaces, sensor connections, and board-level routing flexibility.
• Automotive Qualification — AEC‑Q100 qualification, enabling use in automotive designs where that qualification is required.
• Power — Core voltage supply specified from 1.15 V to 1.25 V for consistent power planning and regulation.
• Package — 256-LBGA package (supplier device package: 256-FBGA, 17×17) for compact board integration.
• Temperature Range — Rated for operation from –40 °C to 125 °C for broad thermal environments.
• Compliance — RoHS‑compliant construction for regulatory and manufacturing alignment.

Typical Applications

• Automotive control systems — Use the AEC‑Q100‑qualified FPGA for configurable control logic, sensor interfacing, and in-vehicle signal processing.
• Embedded signal processing — Deploy on-board RAM and logic elements for deterministic, low-latency data paths and custom protocol handling.
• Interface bridging and glue logic — Leverage the 178 I/Os to adapt between different bus standards, aggregate signals, or offload MCU/MPU tasks.
• Industrial embedded systems — Suitable for designs requiring extended temperature range and robust packaging for fielded equipment.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 rating enables integration into automotive designs where qualification is required.
• Balanced resource mix: 4,000 logic elements plus 193,536 RAM bits provide a practical combination of logic and on‑chip memory for many embedded functions.
• High I/O count: 178 I/Os allow flexible interfacing and multiple parallel connections without external multiplexing.
• Wide operating temperature: –40 °C to 125 °C supports deployment across diverse environmental conditions.
• Compact packaging: 256‑LBGA (supplier 256‑FBGA, 17×17) delivers a small footprint for space‑constrained boards.
• Defined power envelope: Core supply range of 1.15–1.25 V simplifies power supply design and thermal planning.

Why Choose 10M04DAF256A7G?

The 10M04DAF256A7G positions itself as a practical, automotive‑qualified FPGA option with a clear balance of logic capacity, on‑chip RAM, and I/O resources. Its temperature and qualification characteristics make it appropriate for designs that must meet automotive or other demanding environmental requirements while retaining FPGA flexibility.

This device fits teams needing a reconfigurable, mid-density FPGA for embedded control, interface logic, and signal processing tasks where AEC‑Q100 qualification and a defined power and thermal envelope are important for long‑term product reliability.

Request a quote or submit an RFQ today to check availability and pricing for 10M04DAF256A7G.