10M04DAF256C8G

The 10M04DAF256C8G is a MAX® 10 FPGA in a compact 256-ball package designed for commercial embedded applications. It delivers a balanced combination of logic capacity, on-chip RAM, and flexible I/O to support moderate-complexity designs in a surface-mount form factor.

Key value propositions include 4,000 logic elements, 193,536 bits of on-chip RAM, and up to 178 I/Os, coupled with low-voltage operation (1.15 V–1.25 V) and a commercial operating temperature range (0 °C to 85 °C).

Key Features

• Logic Capacity — 4,000 logic elements (logic cells) to implement combinational and sequential logic for mid-range designs.
• On-chip Memory — 193,536 total RAM bits for data buffering, state storage, and embedded memory needs without external RAM.
• I/O Count — 178 I/Os to support multiple peripherals, interfaces, and external devices.
• Power — Low-voltage core operation with a supply range of 1.15 V to 1.25 V for power-conscious designs.
• Package & Mounting — 256-LBGA package case; supplier device package listed as 256-FBGA (17×17). Surface-mount device for compact PCB integration.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
• MAX 10 Family — Part of the Intel MAX 10 device family; documented in the MAX 10 FPGA device datasheet covering electrical, switching, and configuration specifications.

Typical Applications

• Commercial Embedded Systems — Implement control logic, protocol glue, and custom processing in embedded products that fit within the commercial temperature range.
• Consumer Electronics — Manage user interfaces, peripheral aggregation, and custom signal handling using available I/O and on-chip memory.
• Prototyping and Development — Validate logic architectures and memory usage with a gate-array platform that balances capacity and board footprint.
• Communications and Interfaces — Bridge and adapt multiple serial or parallel interfaces using up to 178 I/Os and internal RAM for buffering.

Unique Advantages

• Balanced resource set: 4,000 logic elements paired with 193,536 bits of RAM provide sufficient on-chip resources for many mid-range FPGA tasks without immediate need for external memory.
• High I/O density: 178 I/Os enable integration of multiple sensors, interfaces, or peripherals on a single device, reducing BOM complexity.
• Compact surface-mount package: 256-ball LBGA/FBGA packaging (17×17) allows a small board footprint while maintaining routable I/O density.
• Low-voltage operation: 1.15 V–1.25 V supply supports power-sensitive designs and integration with modern low-voltage systems.
• Commercial temperature and RoHS compliance: Designed for commercial deployments and compliant with RoHS environmental requirements.

Why Choose 10M04DAF256C8G?

The 10M04DAF256C8G positions itself as a practical choice for commercial applications that require a mid-range FPGA with balanced logic, memory, and I/O resources in a compact package. Its combination of 4,000 logic elements, substantial on-chip RAM, and 178 I/Os makes it suitable for embedded control, interface aggregation, and prototyping tasks where board space and power are considerations.

As part of the MAX 10 family, this device is documented with detailed electrical and configuration specifications, enabling engineering teams to evaluate system-level integration, power budgeting, and timing early in the design cycle.

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