10M04DAF256C7G

The 10M04DAF256C7G is an Intel MAX® 10 FPGA in a 256-ball BGA package, designed for surface-mount assembly. It provides a moderate-density programmable-logic device with on-chip RAM and a substantial I/O complement for commercial-temperature applications.

Key device attributes include 4,000 logic elements, 193,536 bits of on-chip RAM, and 178 I/O pins. The device operates from a 1.15 V to 1.25 V core supply and is specified for 0 °C to 85 °C operating temperature; it is RoHS compliant.

Key Features

• Logic Capacity — 4,000 logic elements to implement moderate-complexity digital logic and custom functions.
• On‑Chip Memory — 193,536 total RAM bits for buffering, state storage, and small data structures without external memory.
• I/O Density — 178 I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Package & Mounting — 256-ball BGA package (listed as 256-LBGA and 256-FBGA 17×17) optimized for surface-mount assembly and compact board layouts.
• Power — Core supply range of 1.15 V to 1.25 V, as specified for device operation.
• Commercial Grade & Temperature — Rated for commercial operation across 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Custom digital logic and prototyping — Use the 4,000 logic elements and on-chip RAM to implement moderate-complexity custom logic and proof-of-concept designs.
• I/O‑rich interface control — Up to 178 I/O pins enable aggregation and control of multiple sensors, peripherals, or mixed digital interfaces.
• Compact, surface-mount systems — The 256-ball BGA (17×17) package supports space-constrained board designs requiring a compact FPGA solution.

Unique Advantages

• Balanced logic and memory — 4,000 logic elements combined with 193,536 bits of RAM deliver the resources needed for control logic and on-chip data storage without external memory in many designs.
• High I/O count — 178 I/O pins provide flexible connectivity for multi-peripheral and multi-channel designs.
• Compact BGA footprint — 256-ball (17×17) BGA package supports dense PCB integration while preserving routing efficiency.
• Defined supply and thermal envelope — Clear core-voltage range (1.15 V–1.25 V) and commercial operating temperature (0 °C–85 °C) simplify power and thermal planning.
• Regulatory readiness — RoHS compliance supports use in RoHS-directed product builds.

Why Choose 10M04DAF256C7G?

The 10M04DAF256C7G delivers a compact, surface-mount FPGA option with a blend of logic resources, on-chip RAM, and a large I/O count suitable for moderate-complexity designs in the commercial temperature range. Its specified core-voltage window and package options make it straightforward to integrate into compact PCB layouts that require significant I/O and internal memory.

This device is appropriate for engineers and teams looking for a MAX® 10 family FPGA with 4,000 logic elements, ample on-chip RAM, and 178 I/Os in a 256-ball BGA package, while maintaining RoHS compliance and commercial-temperature operation.

Request a quote or submit an inquiry to obtain pricing and availability for the 10M04DAF256C7G.