10M04DAU324C8G

The 10M04DAU324C8G is an Intel MAX® 10 field programmable gate array (FPGA) in a 324-LFBGA package. It provides a moderate logic density platform with integrated on-chip RAM and a high I/O count suitable for compact, I/O-rich programmable logic designs.

Key on-board attributes include 4,000 logic elements, 193,536 bits of total RAM, up to 246 I/Os, and a low-voltage core supply range of 1.15 V to 1.25 V. The device is supplied as a surface-mount 324-UBGA (15×15) package and is RoHS compliant.

Key Features

• Core Logic  Provides 4,000 logic elements for implementing custom digital logic and control functions.
• On-Chip Memory  Total of 193,536 bits of RAM to support buffering, state storage, and embedded data structures.
• I/O Capacity  Up to 246 I/Os for high signal-count designs and external peripheral interfacing.
• Power  Operates with a voltage supply range of 1.15 V to 1.25 V for core power planning and power budgeting.
• Package & Mounting  324-LFBGA (supplier package: 324-UBGA, 15×15) in a surface-mount format for space-efficient PCB integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard ambient conditions.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• I/O-dense designs  Systems that require a large number of external signals can take advantage of up to 246 I/Os.
• Compact board-level integration  The 324-LFBGA (15×15) package and surface-mount mounting enable space-conscious PCB layouts.
• Logic and control implementations  Use the 4,000 logic elements and on-chip RAM for custom control logic, glue logic, and protocol handling.
• Low-voltage FPGA designs  Systems designed around a 1.15 V–1.25 V core supply can integrate this device for consistent power planning.

Unique Advantages

• Balanced logic and memory  4,000 logic elements paired with 193,536 bits of RAM provide a balanced resource mix for mid-density programmable designs.
• High I/O density  Up to 246 I/Os reduces the need for external I/O expanders and simplifies system interconnects.
• Space-efficient packaging  324-LFBGA (324-UBGA, 15×15) enables compact board layouts while retaining sizable pin count.
• Predictable power envelope  A defined core supply range (1.15 V–1.25 V) helps simplify power-supply design and thermal planning.
• Commercial temperature suitability  Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliant  Meets common environmental and manufacturing requirements for lead-free assembly.

Why Choose 10M04DAU324C8G?

The 10M04DAU324C8G delivers a compact, I/O-rich FPGA option with a balanced set of logic and memory resources. Its 4,000 logic elements and 193,536 bits of on-chip RAM support a wide range of mid-density programmable functions while the 246 I/Os and 324-LFBGA package enable dense system integration on space-constrained PCBs.

This device is a fit for designers seeking a commercial-grade, RoHS-compliant FPGA with a clearly defined power envelope (1.15 V–1.25 V) and standard operating temperature range (0 °C–85 °C). It is suitable for projects that require predictable electrical and packaging characteristics backed by the MAX® 10 device documentation.

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