10M04DCF256A7G

The 10M04DCF256A7G is an Intel MAX® 10 field programmable gate array (FPGA) provided in a 256-LBGA surface-mount package. It integrates reconfigurable logic with on-chip RAM and a high I/O count to address embedded designs that require compact, qualified programmable logic.

This device is offered as automotive grade and carries AEC‑Q100 qualification, supports operation from −40 °C to 125 °C, and operates from a 1.15 V to 1.25 V supply—making it suitable for systems that demand qualified, wide-temperature operation in a small-footprint package.

Key Features

• Core Logic 4000 logic elements provide reconfigurable logic capacity for control, glue logic, and custom peripheral implementations.
• On‑chip Memory 193,536 total RAM bits enable local buffering and fast data handling without external memory.
• I/O 178 user I/O pins support a broad range of external interfaces and signal connectivity.
• Power Narrow supply range from 1.15 V to 1.25 V for predictable power budgeting at the device level.
• Package & Mounting 256‑LBGA package (supplier device package: 256‑FBGA, 17×17) in a surface-mount form factor for space-constrained PCBs.
• Automotive Qualification Classified as Automotive grade with AEC‑Q100 qualification for applications requiring recognized automotive reliability standards.
• Operating Temperature Rated for −40 °C to 125 °C to support deployment across extended temperature environments.
• Environmental Compliance RoHS compliant, meeting common environmental and material restrictions.

Typical Applications

• Automotive control systems AEC‑Q100 qualification and wide temperature rating support integration into in-vehicle control modules and electronic subsystems.
• Embedded control and I/O aggregation Moderate logic density paired with 178 I/O and substantial on-chip RAM fits compact embedded controllers and interface concentrators.
• Sensor interfacing and preprocessing On-chip memory and plentiful I/O enable local buffering and preprocessing of sensor data in harsh operating environments.

Unique Advantages

• Automotive-qualified reliability: AEC‑Q100 qualification provides documented suitability for automotive applications that require component-level qualification.
• Balanced resource set: 4000 logic elements and 193,536 bits of RAM deliver a practical mix of logic and memory for control, buffering, and data-path tasks.
• High I/O density: 178 I/O pins reduce the need for external multiplexing and streamline system-level interfaces.
• Compact surface-mount package: 256‑LBGA (256‑FBGA, 17×17) enables high-density PCB layouts in constrained form factors.
• Wide temperature operation: −40 °C to 125 °C rating supports deployment across demanding thermal environments common in automotive and related applications.
• Predictable power profile: 1.15 V to 1.25 V supply range simplifies power budgeting and system-level power planning.

Why Choose 10M04DCF256A7G?

The 10M04DCF256A7G is positioned for designs that require a compact, automotive‑qualified FPGA with a balanced combination of logic elements, on-chip memory, and a high I/O count. Its 256‑LBGA footprint, AEC‑Q100 qualification, and wide operating temperature range make it a clear fit where qualified performance and small PCB area are priorities.

Choose this part when you need a qualified, mid-density FPGA for embedded control, sensor interfacing, or I/O aggregation tasks where predictable power, significant on‑chip RAM, and robust operating-range specifications matter for long-term deployment.

Request a quote or submit an inquiry for pricing and availability of 10M04DCF256A7G to begin integrating this automotive‑qualified MAX® 10 FPGA into your design.