10M04DCF256I7G

The 10M04DCF256I7G is an Intel MAX® 10 FPGA supplied in a 256‑ball L‑BGA surface‑mount package. It combines a mid-range logic array with substantial on‑chip RAM and a high pin‑count I/O complement for configurable digital designs.

Designed as an industrial‑grade device (speed grade -I7), this FPGA operates from a 1.15 V to 1.25 V core supply and across an operating temperature range of -40 °C to 100 °C, making it suitable for deployment in industrial environments that require programmable logic with significant on‑chip memory and I/O resources.

Key Features

• Core Logic — Approximately 4,000 logic elements for implementing custom combinational and sequential logic functions.
• On‑chip Memory — 193,536 total RAM bits to support data buffering, small FIFOs, and state storage without external memory.
• I/O Capability — Up to 178 I/Os to interface with sensors, peripherals, or other digital subsystems.
• Supply Voltage — Core voltage operating range of 1.15 V to 1.25 V to match system power domains.
• Package & Mounting — 256‑LBGA surface‑mount package; supplier device package listed as 256‑FBGA (17×17) for compact board integration.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C and supplied as an industrial speed grade (-I7).
• Regulatory — RoHS compliant for environmental conformity in assemblies.

Typical Applications

• Industrial Automation — Programmable control logic and interface glue where industrial temperature range and a high I/O count are required.
• Embedded Processing Modules — Offloading custom logic and buffering tasks using on‑chip RAM and 4,000 logic elements in compact modules.
• I/O Aggregation and Interfacing — Centralizing multiple digital signals and protocol logic with up to 178 I/Os to simplify system wiring and board layout.

Unique Advantages

• Balanced Logic Density: ~4,000 logic elements provide a middle ground between minimal PLDs and larger FPGAs for cost‑sensitive, mid‑complexity designs.
• Substantial On‑Chip RAM: 193,536 RAM bits reduce dependence on external memory for buffering and local storage, simplifying BOM and board routing.
• High I/O Count: 178 available I/Os enable direct connectivity to a wide range of peripherals and sensors without external expanders.
• Industrial Operating Range: Rated −40 °C to 100 °C and supplied as an industrial speed grade (-I7), supporting deployment in harsher environments.
• Compact Package: 256‑LBGA (256‑FBGA 17×17) enables high density placement on space‑constrained PCBs while maintaining robust I/O.
• RoHS Compliance: Aligns with common environmental and assembly requirements for modern electronics manufacturing.

Why Choose 10M04DCF256I7G?

The 10M04DCF256I7G positions itself for engineering teams that need a configurable, industrial‑grade FPGA with moderate logic capacity, extensive on‑chip RAM, and a large I/O complement in a compact BGA package. Its 1.15 V–1.25 V core supply and −40 °C to 100 °C operating range support robust embedded and industrial designs.

This device is suitable for projects seeking a balance of integration and reliability—providing on‑chip resources that can simplify system architecture, reduce external component count, and support long‑term deployment in industrial environments.

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