10M04DCU324C8G

The 10M04DCU324C8G is a MAX® 10 field programmable gate array (FPGA) from Intel, presented in a compact 324-LFBGA package. It provides a balance of programmable logic, on-chip RAM, and flexible I/O for commercial-grade embedded designs.

With 4,000 logic elements, 193,536 bits of on-chip RAM, and up to 246 I/O pins, this device is suited for applications that require moderate logic density and significant I/O connectivity while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Architecture: MAX® 10 FPGA from Intel, delivering reprogrammable logic in a single-chip solution.
• Logic Capacity: 4,000 logic elements implemented across 250 LABs, enabling a range of mid-density logic designs.
• On-Chip Memory: 193,536 total RAM bits for embedded data buffering, state machines, and small LUT-based memories.
• I/O Resources: Up to 246 I/O pins to support multiple parallel interfaces and system-level connectivity.
• Power: Core voltage supply range of 1.15 V to 1.25 V for the device core supply requirements.
• Package & Mounting: 324-LFBGA package (supplier device package 324-UBGA, 15×15) with surface-mount mounting for compact board placement.
• Grade & Temperature: Commercial grade with an operating temperature range from 0 °C to 85 °C.
• Environmental Compliance: RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Embedded Control: Use the device’s 4,000 logic elements and on-chip RAM to implement control algorithms, state machines, and timing-critical logic for commercial embedded systems.
• Interface Bridging: Leverage up to 246 I/Os to implement protocol translation, glue logic, and parallel/serial interface aggregation between subsystems.
• User Interface and Display Control: Deploy the device to manage display drivers, touch controllers, and HMI logic where moderate logic density and flexible I/O are required.
• Prototyping and Development: Ideal for developers needing a reprogrammable platform with substantial RAM and I/O capacity in a compact package for proof-of-concept and evaluation.

Unique Advantages

• Balanced Logic and Memory: 4,000 logic elements paired with 193,536 bits of on-chip RAM supports combined control and buffering functions without external memory in many designs.
• High I/O Count: 246 I/Os enable broad connectivity to sensors, peripherals, and external controllers, reducing the need for additional interface chips.
• Compact, Surface-Mount Package: 324-LFBGA (324-UBGA, 15×15) offers a space-efficient footprint for dense board designs while maintaining necessary signals.
• Low-Voltage Core Support: 1.15 V–1.25 V supply range supports modern low-voltage system architectures.
• Commercial Temperature Range: Rated 0 °C to 85 °C for applications targeted at commercial-environment products.
• RoHS Compliant: Meets environmental requirements for lead-free production and assembly.

Why Choose 10M04DCU324C8G?

The 10M04DCU324C8G positions itself as a compact, commercially rated FPGA solution that combines moderate logic capacity, substantial on-chip RAM, and a high I/O count in a 324-LFBGA surface-mount package. Its specification set makes it appropriate for embedded control, interface bridging, and HMI tasks where space, connectivity, and reprogrammability are important.

Engineers and purchasers looking for a field-programmable device with clear, verifiable resource counts—4,000 logic elements, 193,536 RAM bits, 246 I/Os—and defined power and temperature envelopes will find this part aligns to predictable design and integration requirements.

Request a quote or submit your inquiry for the 10M04DCU324C8G to receive pricing and availability information tailored to your project needs.