10M04DCF256C8G

IC FPGA 178 I/O 256FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 178 193536 4000 256-LBGA

Quantity 169 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O178Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250Number of Logic Elements/Cells4000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits193536

Overview of 10M04DCF256C8G – MAX® 10 Field Programmable Gate Array (FPGA) IC 178 193536 4000 256-LBGA

The 10M04DCF256C8G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel, provided in a 256-LBGA package. This commercial-grade FPGA integrates reprogrammable logic with on-chip RAM and a high number of I/O to support compact, flexible digital designs.

With 4,000 logic elements, 193,536 bits of total RAM, and 178 I/O pins, the device targets applications that require moderate logic capacity, embedded memory, and dense I/O in a surface-mount BGA footprint. It operates from a 1.15 V to 1.25 V supply and across a 0 °C to 85 °C commercial temperature range, and is RoHS compliant.

Key Features

  • Logic Capacity  4,000 logic elements provide programmable resources for implementing combinational and sequential logic functions.
  • On-Chip Memory  Total RAM of 193,536 bits supports data buffering, small FIFOs, and local storage for user logic.
  • I/O Density  178 I/O pins enable connectivity to peripherals, sensors, and external devices while supporting packed interface routing in a compact package.
  • Power Supply  Device operates from a 1.15 V to 1.25 V supply, allowing designers to match system power rails within that range.
  • Package & Mounting  256-LBGA package with surface-mount mounting; supplier device package listed as 256-FBGA (17×17) for PCB footprint planning.
  • Commercial Operating Range  Rated for 0 °C to 85 °C operation, suitable for commercial-temperature applications.
  • Regulatory  RoHS compliant.

Unique Advantages

  • Balanced logic and memory: 4,000 logic elements combined with 193,536 bits of RAM provide a balanced resource set for moderate-complexity programmable designs.
  • High I/O count: 178 I/O pins enable flexible interfacing options without requiring larger-package alternatives.
  • Compact BGA footprint: 256-LBGA / 256-FBGA (17×17) packaging reduces PCB area while supporting high pin density and surface-mount assembly.
  • Controlled-power operation: Narrow supply window (1.15 V–1.25 V) simplifies power sequencing and margining around a defined core voltage.
  • Commercial-grade temperature: Rated 0 °C to 85 °C for mainstream commercial applications and environments.

Why Choose 10M04DCF256C8G?

The 10M04DCF256C8G delivers a practical combination of logic resources, embedded memory, and I/O density in a compact BGA package for commercial designs. Its specification set—4,000 logic elements, 193,536 bits of RAM, 178 I/O pins, and a defined supply voltage range—makes it suitable for projects that require moderate programmable logic capacity with on-chip storage and dense interfacing.

Designed for commercial deployments, this MAX® 10 FPGA provides a predictable thermal and electrical profile and RoHS compliance, helping teams streamline BOM and PCB planning while leveraging on-device resources to reduce external components.

Request a quote or submit a purchase inquiry to get pricing and availability for the 10M04DCF256C8G.

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