10M04DCU324I7P

The 10M04DCU324I7P is an Intel MAX® 10 Field Programmable Gate Array (FPGA) offered in a 324‑LFBGA package. It delivers a mid‑density programmable logic solution with integrated on‑chip memory and a high I/O count for compact, industrial‑grade designs.

Designed for applications that require a balance of logic, embedded RAM, and plentiful I/O, this device provides a low‑voltage core supply and wide operating temperature range to support deployment in demanding environments.

Key Features

• Logic Capacity  4,000 logic elements to implement mid‑density combinational and sequential logic functions.
• On‑Chip Memory  193,536 total RAM bits for embedded data buffering, FIFOs, and small on‑chip storage requirements.
• High I/O Count  246 user I/O pins to support multiple interfaces, parallel buses, and dense peripheral connectivity.
• Power  Core voltage supply range of 1.15 V to 1.25 V for the device core.
• Package & Mounting  324‑LFBGA package (supplier device package: 324‑UBGA, 15×15) in a surface‑mount form factor for PCB space efficiency.
• Industrial Grade & Temperature Range  Specified grade: Industrial with an operating temperature range of −40 °C to 100 °C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial control  Industrial‑grade temperature rating and robust I/O count make the device suitable for control logic and interfacing in automation equipment.
• Embedded systems  On‑chip RAM combined with 4,000 logic elements supports local data processing and glue‑logic in compact embedded designs.
• I/O‑dense designs  High pin count accommodates parallel sensors, buses, and multiple peripheral connections in space‑constrained boards.

Unique Advantages

• Balanced mid‑density integration: 4,000 logic elements together with 193,536 RAM bits provide a practical balance of logic and memory for many embedded functions without external RAM.
• High peripheral connectivity: 246 I/O pins allow flexible interfacing to multiple external devices and bus architectures, reducing the need for external IO expanders.
• Compact BGA packaging: 324‑LFBGA (324‑UBGA, 15×15) gives a small PCB footprint while maintaining high pin count for dense board designs.
• Industrial temperature capability: Rated for −40 °C to 100 °C and specified as industrial grade for use in temperature‑challenging environments.
• Low‑voltage core operation: 1.15 V to 1.25 V core supply enables integration into modern low‑voltage power domains.
• RoHS compliance: Meets RoHS requirements for environmental and regulatory alignment.

Why Choose 10M04DCU324I7P?

The 10M04DCU324I7P delivers a practical, industrial‑grade FPGA option that combines 4,000 logic elements, substantial on‑chip memory, and a high I/O count in a compact 324‑LFBGA package. Its low core voltage and wide operating temperature range make it suitable for embedded and industrial applications that require reliable, space‑efficient programmable logic.

This device is well suited for design teams seeking a scalable, integrated solution that reduces board-level complexity by consolidating logic and memory on‑chip while providing the I/O resources to interface with multiple peripherals and buses.

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