10M02SCU169I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 130 110592 2000 169-LFBGA |
|---|---|
| Quantity | 343 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 169-UBGA (11x11) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 169-LFBGA | Number of I/O | 130 | Voltage | 2.85 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 125 | Number of Logic Elements/Cells | 2000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of 10M02SCU169I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC 130 110592 2000 169-LFBGA
The 10M02SCU169I7G is an Intel MAX® 10 FPGA supplied in a 169-LFBGA package. It offers 2,000 logic elements, 110,592 total RAM bits and 130 user I/O, providing a compact programmable logic option for industrial designs.
Designed for surface-mount integration, this device operates from a 2.85 V to 3.465 V supply and supports an industrial operating range of −40 °C to 100 °C. The part is RoHS compliant and is offered in an industrial speed grade (-I7) within the MAX® 10 device family.
Key Features
- Logic Capacity 2,000 logic elements for implementing custom control, glue logic, and small-scale programmable functions.
- On-Chip Memory 110,592 total RAM bits to support local buffering, state storage, and small data structures without external memory.
- I/O Count 130 user I/O pins suitable for interfacing multiple peripherals, sensors, or parallel interfaces.
- Power Supply Operates from 2.85 V to 3.465 V supply rails, enabling integration with common industrial power domains.
- Package & Mounting 169‑LFBGA package (supplier device package: 169‑UBGA, 11×11) in a surface-mount form factor for dense PCB layouts.
- Industrial Grade & Temperature Industrial grade device with an operating temperature range of −40 °C to 100 °C to meet extended-environment requirements.
- Compliance RoHS compliant for environmental and regulatory alignment.
- Family and Speed Grade Part of the Intel MAX® 10 FPGA family and specified with an industrial speed grade (-I7) supported by the device datasheet.
Typical Applications
- I/O expansion and glue logic Use the 130 user I/O and 2,000 logic elements to implement interface bridging, protocol adaptation, and board-level glue logic.
- Local buffering and control On-chip RAM (110,592 bits) supports buffering, small data queues and localized state machines for embedded control tasks.
- Industrial control and monitoring Industrial temperature rating (−40 °C to 100 °C) and surface-mount packaging make this device suitable for control modules and instrumentation in challenging environments.
Unique Advantages
- Compact programmable logic: 2,000 logic elements and substantial on-chip RAM provide a compact alternative to discrete logic and small external memory solutions.
- High I/O density: 130 user I/O pins simplify interfacing to multiple peripherals without adding external I/O expanders.
- Industrial-ready thermal range: Rated for −40 °C to 100 °C operation to support deployment in extended-temperature applications.
- Surface-mount LFBGA package: 169-LFBGA (169-UBGA, 11×11) enables PCB area optimization and reliable board-level assembly.
- RoHS compliance: Meets environmental regulations for lead-free manufacturing and global distribution.
- MAX® 10 family integration: Part of the Intel MAX® 10 FPGA family with supported industrial speed grade (-I7), providing predictable device selection within the family.
Why Choose 10M02SCU169I7G?
The 10M02SCU169I7G balances moderate logic capacity, significant on-chip RAM, and high I/O count in a compact industrial-grade LFBGA package. Its 2,000 logic elements and 110,592 RAM bits make it well suited for control logic, I/O interfacing, and localized buffering tasks where board space and integration are priorities.
With a 2.85 V to 3.465 V supply range, RoHS compliance, and an operating temperature range of −40 °C to 100 °C, this MAX® 10 device provides a reliable programmable solution for industrial designs that require a predictable family migration path and supported speed-grade options.
Request a quote or submit an RFQ to obtain pricing and availability for 10M02SCU169I7G. Our team can provide lead-time estimates and supply options to support your project schedule.

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