10M04SCM153C8G

The 10M04SCM153C8G is a MAX® 10 Field Programmable Gate Array (FPGA) in a 153-ball VFBGA package. It provides a moderate-density programmable logic fabric with on-chip RAM and a high I/O count for commercial embedded designs.

Designed for applications that require configurable digital logic, multiple external interfaces and on-chip memory, this device balances integration and board-space efficiency while operating across a commercial temperature range.

Key Features

• Logic Capacity — 4,000 logic elements provide the programmable fabric for implementing custom digital functions and glue logic.
• On-Chip Memory — 193,536 total RAM bits available for buffering, FIFOs and small data structures directly within the FPGA fabric.
• I/O Density — 112 I/O pins to support multiple peripheral interfaces, sensor connections and board-level signal routing.
• Power Supply — Operates from 2.85 V to 3.465 V, matching common commercial logic power rails.
• Package — 153-ball VFBGA package (supplier device package: 153-MBGA, 8×8) for compact board integration.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C for typical commercial environments.
• Regulatory — RoHS compliant.

Typical Applications

• Embedded control and glue logic — 4,000 logic elements and 112 I/Os enable implementation of custom control functions and interface glue between processors and peripherals.
• Data buffering and preprocessing — 193,536 RAM bits support on-chip buffering and small-scale data manipulation before handing data off to other system components.
• Compact, I/O-rich modules — The 153-ball VFBGA package and high I/O count suit space-constrained modules that need significant external connectivity.

Unique Advantages

• Balanced logic and memory mix: 4,000 logic elements combined with 193,536 RAM bits let designers implement both control logic and local data storage on a single device, reducing board-level memory requirements.
• High external connectivity: 112 I/Os provide flexibility for multiple interfaces and sensor connections without additional I/O expanders.
• Compact packaging: 153-ball VFBGA (153-MBGA, 8×8) delivers a small footprint for space-sensitive designs while maintaining necessary pin count.
• Commercial temperature suitability: Rated 0 °C to 85 °C to match typical commercial application environments.
• RoHS compliant: Meets common environmental compliance requirements for commercial electronic products.

Why Choose 10M04SCM153C8G?

The 10M04SCM153C8G positions itself as a mid-density, commercial-grade FPGA that combines a practical balance of logic resources, on-chip RAM and ample I/O in a compact package. Its voltage and temperature ratings align with common commercial system designs, making it a straightforward choice when board space and I/O count are key considerations.

This device is well suited for engineers and procurement teams building commercial embedded systems that require configurable logic, modest on-chip memory and flexible interfacing. Its combination of features supports scalable design iterations and helps simplify BOMs by consolidating logic and memory on a single chip.

Request a quote or submit an inquiry for pricing and availability of 10M04SCM153C8G to move your design forward.