10M04SCU169C8G

The 10M04SCU169C8G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) supplied in a 169-LFBGA package. It provides a mid-range logic capacity with on-chip RAM and a substantial I/O count targeted at commercial embedded designs.

With a specified operating voltage range of 2.85 V to 3.465 V, surface-mount 169-UBGA (11×11) packaging, RoHS compliance and a commercial temperature rating (0 °C to 85 °C), this device is positioned for integration into space-constrained, commercial applications that require programmable logic, embedded RAM, and a flexible I/O footprint.

Key Features

• Core Logic  Approximately 4,000 logic elements provide mid-density programmable logic capacity for control, glue-logic and moderate-complexity functions.
• Memory  On-chip RAM totaling 193,536 bits supports data buffering, small lookup tables and local storage without external memory.
• I/O Count  Up to 130 user I/Os allow for broad interfacing with peripherals, sensors, and other board-level devices.
• Package and Mounting  169-LFBGA package (Supplier device package: 169-UBGA, 11×11) in a surface-mount form factor for compact PCB integration.
• Power  Operates from 2.85 V to 3.465 V supply rails, enabling use with common commercial power domains.
• Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C suited to standard commercial operating environments.
• Environmental Compliance  RoHS compliant for regulatory conformity in lead-free commercial products.

Typical Applications

• Commercial embedded systems  Use where a mid-density FPGA with 4,000 logic elements and 130 I/Os is needed for control, sequencing or custom logic functions.
• On-board protocol bridging  Implement protocol conversion or interface logic leveraging the device’s I/O count and on-chip RAM.
• Compact PCB designs  Suitable for space-constrained boards that require surface-mount BGA packaging (169-UBGA, 11×11).
• Memory-assisted logic  Designs that benefit from nearly 193.5k bits of on-chip RAM for buffering, FIFOs or small tables.

Unique Advantages

• Balanced logic and memory: Combines approximately 4,000 logic elements with 193,536 bits of on-chip RAM to support integrated logic and data tasks without external memory.
• High I/O density: 130 I/Os enable multiple peripheral interfaces and flexible board-level connectivity.
• Compact surface-mount package: 169-LFBGA / 169-UBGA (11×11) packaging supports compact PCB layouts and dense system integration.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial operating environments.
• RoHS compliant: Meets lead-free environmental requirements for commercial products.
• Standard supply range: Operates from 2.85 V to 3.465 V for compatibility with common commercial power architectures.

Why Choose 10M04SCU169C8G?

The 10M04SCU169C8G offers a practical combination of mid-range logic capacity, substantial on-chip RAM and a high I/O count in a compact 169-LFBGA surface-mount package. Its commercial temperature rating and RoHS compliance make it a straightforward choice for commercial embedded designs that require moderate programmable logic density and flexible interfacing.

This device is suited to designers who need a balanced FPGA solution for integration into space-constrained boards, leveraging on-chip RAM to reduce external components while maintaining a large I/O footprint for system connectivity.

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