10M08DAU324C8G

The 10M08DAU324C8G is an Intel MAX® 10 field-programmable gate array (FPGA) in a 324-LFBGA (15×15) surface-mount package. It provides programmable logic capacity, on-chip RAM, and extensive I/O in a compact commercial-grade device.

Key attributes include 8,000 logic elements, 387,072 total RAM bits, and up to 246 I/O pins, making this device suitable for compact designs that require substantial on-chip resources within a 1.15 V–1.25 V core supply and a 0 °C to 85 °C operating range.

Key Features

• Core (Logic Capacity) — 500 CLBs delivering 8,000 logic elements to implement combinational and sequential logic functions.
• On‑Chip Memory — 387,072 total RAM bits available for data buffering, state storage, and LUT-based memory structures.
• I/O — Up to 246 I/O pins for flexible external interfacing and peripheral connections.
• Package & Mounting — 324-LFBGA (324-UBGA, 15×15) package in a surface-mount form factor for compact PCB integration.
• Power Supply — Core voltage range specified at 1.15 V to 1.25 V to match system power rails.
• Operating Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Unique Advantages

• Balanced logic and memory resources: 8,000 logic elements paired with 387,072 RAM bits enable integration of control logic and data storage on a single device, reducing external component count.
• High I/O count: 246 I/O pins support multiple interfaces and parallel signals without additional multiplexing hardware.
• Compact BGA package: The 324-LFBGA (15×15) surface-mount package offers a small footprint for space-constrained boards while providing robust pinout density.
• Commercial temperature range: Rated 0 °C to 85 °C for standard commercial applications and environments.
• RoHS compliant: Conforms to RoHS requirements for environmental and regulatory considerations.

Why Choose 10M08DAU324C8G?

The 10M08DAU324C8G delivers a practical balance of programmable logic, on‑chip RAM, and extensive I/O in a compact 324-LFBGA package. Its specification set—8,000 logic elements, 387,072 RAM bits, and 246 I/O—addresses designs that require significant on-chip resources while maintaining a commercial operating range and surface-mount packaging for streamlined assembly.

This device is appropriate for designs where integration, pin density, and predictable operating conditions are priorities. Its MAX® 10 FPGA platform provides documented electrical and configuration details to support development and system integration.

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