10M08DAU324C8GES

The 10M08DAU324C8GES is a MAX® 10 field programmable gate array (FPGA) IC from Intel, provided in a 324-LFBGA package. The device integrates 8,000 logic elements, 387,072 bits of on-chip RAM and supports up to 246 I/Os, making it suitable for designs that require moderate logic density with significant on-chip memory and I/O capacity.

Designed for commercial-grade applications, the device operates from a 1.15 V to 1.25 V supply and across an operating temperature range of 0 °C to 85 °C. It is supplied in a surface-mount 324-UBGA (15×15) package and is RoHS compliant.

Key Features

• Core Logic  Provides 8,000 logic elements to implement custom digital functions and moderate-complexity IP.
• On-Chip Memory  Offers 387,072 total RAM bits for local buffering, state storage, and small lookup tables without immediate need for external memory.
• I/O Capacity  Up to 246 I/Os to support multiple interfaces and parallel signals directly from the FPGA fabric.
• Package and Mounting  Delivered in a 324-LFBGA / 324-UBGA (15×15) surface-mount package for compact board integration.
• Power  Operates from a 1.15 V to 1.25 V supply voltage range.
• Environmental and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Custom Logic and Prototyping  Implement user-defined digital functions that require up to 8,000 logic elements and substantial on-chip RAM for prototyping or production designs.
• I/O-Intensive Interfaces  Support boards and modules that need up to 246 I/Os for parallel buses, multiple serial interfaces, or mixed-signal routing.
• Local Data Buffering  Use the 387,072 bits of on-chip RAM for temporary data storage, FIFOs, or small frame buffers to minimize reliance on external memory.

Unique Advantages

• Balanced Logic and Memory:  8,000 logic elements combined with 387,072 bits of RAM provide a balance of compute and storage for mid-range FPGA tasks.
• High I/O Count:  Up to 246 I/Os enable direct interfacing to multiple peripherals and sensors without extensive external multiplexing.
• Compact Board Footprint:  324-LFBGA / 324-UBGA (15×15) packaging supports dense, surface-mount PCB layouts.
• Commercial Temperature Range:  Rated 0 °C to 85 °C for deployment in commercial applications where this operating range is required.
• RoHS Compliant:  Meets RoHS requirements for lead-free manufacturing and assembly processes.

Why Choose 10M08DAU324C8GES?

The 10M08DAU324C8GES provides a practical combination of logic density, on-chip RAM, and high I/O count in a compact 324-LFBGA package, addressing designs that need substantial local memory and many signal connections without moving to larger FPGA families. Its commercial-grade temperature range and RoHS compliance make it appropriate for a wide range of non-industrial, non-automotive applications.

As a MAX® 10 device from Intel, it offers a defined set of capabilities—8,000 logic elements, 387,072 bits of RAM, 246 I/Os, and a 1.15 V–1.25 V supply range—that support scalable mid-range digital designs where integration and on-chip memory are priorities.

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