10M08DCF256C8G

The 10M08DCF256C8G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 256-ball LFBGA/FBGA package. It provides a balance of programmable logic, embedded RAM, and a high I/O count for commercial embedded applications.

Designed for commercial-grade systems, this device integrates 8,000 logic elements, 387,072 bits of RAM, and up to 178 I/Os while operating from a 1.15 V to 1.25 V supply and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic — 8,000 logic elements provide programmable resources for custom logic, state machines, and glue-logic functions.
• Logic Array Blocks — 500 LABs are available to structure and organize logic resources for efficient implementation.
• On-Chip Memory — 387,072 total RAM bits for data buffering, FIFOs, and small embedded memory needs within the FPGA fabric.
• High I/O Count — 178 I/O pins support extensive peripheral connectivity and parallel interfacing options.
• Power — Operates from a 1.15 V to 1.25 V supply, enabling designs targeting low-voltage FPGA domains.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FBGA, 17×17) in a surface-mount form factor for compact board placement.
• Commercial Grade — Rated for 0 °C to 85 °C operation to meet typical commercial environment requirements.
• RoHS Compliant — Manufactured to meet RoHS requirements for restricted substances.

Typical Applications

• Commercial Embedded Control — Use the FPGA to implement control logic and interfaces in commercial embedded systems that require up to 8,000 logic elements and a high I/O count.
• Peripheral and Interface Bridging — 178 I/Os enable bridging between multiple peripherals or buses in compact system designs.
• On-Board Data Buffering — 387,072 bits of on-chip RAM support buffering, small FIFOs, and temporary data storage for latency-sensitive tasks.
• Compact, Surface-Mount Designs — The 256-ball FBGA/LBGA package and surface-mount mounting suit space-constrained commercial PCBs.

Unique Advantages

• Balanced Logic and Memory: 8,000 logic elements paired with 387,072 RAM bits let you implement control logic alongside local data storage without external memory in many designs.
• Extensive I/O Density: 178 I/Os provide flexibility for multi-channel interfacing, sensor arrays, or parallel data paths, reducing the need for additional I/O expanders.
• Low-Voltage Operation: 1.15 V to 1.25 V supply compatibility supports integration into modern low-voltage power domains.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for reliable operation across standard commercial environments.
• Compact Packaging: 256-LBGA / 256-FBGA (17×17) surface-mount package enables high-density boards while keeping PCB footprint small.
• RoHS Compliance: RoHS status ensures alignment with common environmental and assembly requirements.

Why Choose 10M08DCF256C8G?

The 10M08DCF256C8G positions itself as a commercially rated, compact FPGA solution that combines moderate logic capacity with substantial on-chip memory and a large I/O complement. Its low-voltage operation and surface-mount 256-ball package make it suitable for space-conscious designs that require flexible interfacing and local buffering.

This part is well suited to teams designing commercial embedded systems, interface bridging modules, and compact control electronics that need verifiable logic resources (8,000 logic elements), significant RAM (387,072 bits), and up to 178 I/Os in a single, RoHS-compliant package.

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