10M08DCF484I7G

The 10M08DCF484I7G is an Intel MAX® 10 field programmable gate array provided in a 484-BGA package. It integrates 8,000 logic elements, 387,072 total RAM bits and up to 250 I/O to support configurable digital designs in a compact surface-mount footprint.

Targeted at industrial-grade applications, the device operates from a 1.15 V to 1.25 V supply and is specified for an operating temperature range of −40 °C to 100 °C, providing a balance of integration, density and temperature tolerance for embedded and industrial designs.

Key Features

• Core Logic  8,000 logic elements for implementing custom digital functions and control logic.
• On‑Chip Memory  387,072 total RAM bits for buffering, FIFO storage and local data retention.
• I/O Capacity  Up to 250 I/O pins to support multiple external interfaces and peripherals.
• Package & Mounting  484-FBGA (23 × 23 mm) / 484-BGA surface-mount package for high-density board integration.
• Power  Operates from a defined supply range of 1.15 V to 1.25 V for core power planning.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature rating and programmable logic make this device suitable for automation controllers and factory equipment interfaces.
• I/O‑Rich Interface Bridging  Up to 250 I/O pins enable aggregation and bridging of multiple sensors, actuators and peripheral buses.
• On‑Chip Buffering and Local Storage  387,072 RAM bits provide local memory for buffering data streams and temporary storage in embedded systems.

Unique Advantages

• Highly integrated logic and memory: Combining 8,000 logic elements with substantial on‑chip RAM reduces the need for external components and simplifies board design.
• High I/O density: Up to 250 I/O pins support complex interfacing requirements without large external multiplexer networks.
• Compact BGA packaging: 484-FBGA (23 × 23 mm) surface-mount package enables dense PCB layouts while maintaining a standardized footprint.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in harsh or temperature-varying environments.
• Defined core supply window: 1.15 V to 1.25 V power specification simplifies power-supply planning and validation.
• Regulatory readiness: RoHS compliance facilitates adherence to common materials and environmental requirements.

Why Choose 10M08DCF484I7G?

The 10M08DCF484I7G positions itself as an industrial-grade FPGA option that balances programmable logic density, on-chip memory and high I/O capacity in a compact 484-BGA package. Backed by Intel's MAX® 10 family designation, it is suitable for engineers designing embedded and industrial systems that require configurable logic, local RAM and broad I/O integration.

For designs where board area, on‑chip resources and operating temperature tolerance matter, this part offers a clear set of verifiable specifications to support system planning, BOM reduction and industrial deployment.

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