10M08DCV81C7G

The 10M08DCV81C7G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel in an 81-UFBGA WLCSP package. It delivers 8,000 logic elements, 387,072 bits of on-chip RAM, and 56 I/O pins in a compact 4.5 × 4.4 mm package footprint.

Designed for commercial applications, this device operates from a 1.15 V to 1.25 V supply and across a 0 °C to 85 °C temperature range, offering a balance of integration, on-chip memory, and I/O density for embedded and board-level reconfigurable logic tasks.

Key Features

• Core Capacity 8,000 logic elements provide mid-range programmable logic resources for glue logic, protocol handling, and custom control functions.
• On-Chip Memory 387,072 total RAM bits of embedded memory to support buffering, FIFOs, and small data stores without external memory.
• I/O Resources 56 general-purpose I/O pins suitable for interfacing with peripherals, sensors, and board-level communications.
• Power Low-voltage operation from 1.15 V to 1.25 V for core supply compatibility with modern low-voltage systems.
• Package 81-UFBGA wafer-level chip-scale package (WLCSP), supplier package 81-VBGA (4.5 × 4.4 mm), enabling a compact board footprint.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial environments.
• Compliance RoHS compliant.

Typical Applications

• Commercial Embedded Systems Integration of custom control logic and peripheral interfaces where compact size and on-chip memory reduce external components.
• Consumer Electronics Implementation of user interface control, protocol bridging, or board-level logic in space-constrained devices.
• Communications Interfaces Handling protocol conversion and I/O aggregation using the device’s logic and I/O resources.
• Prototyping and Development Rapid evaluation of mid-density FPGA designs in a small-package form factor.

Unique Advantages

• Compact WLCSP Package: The 81-UFBGA (4.5 × 4.4 mm) footprint minimizes PCB area, enabling denser board layouts and space savings.
• Balanced Logic and Memory: 8,000 logic elements combined with 387,072 RAM bits deliver integrated capability for control and buffering without immediate need for external RAM.
• Generous I/O Count: Fifty-six I/O pins allow flexible interfacing to sensors, peripherals, and communication lines without complex routing compromises.
• Low-Voltage Core: 1.15–1.25 V supply range aligns with modern low-voltage power domains, supporting energy-conscious designs.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for standard commercial environments with RoHS compliance for global manufacturability.

Why Choose 10M08DCV81C7G?

The 10M08DCV81C7G positions itself as a compact, mid-density FPGA solution that combines a useful mix of logic elements, on-chip RAM, and I/O in a small WLCSP package. It is well suited for commercial embedded designs that require reprogrammable logic, modest memory resources, and a reduced PCB footprint.

Engineers and procurement teams seeking a commercially graded MAX® 10 FPGA with defined voltage and temperature ranges will find this device appropriate for board-level integration, prototyping, and space-constrained applications where consolidation of discrete logic and memory can simplify the bill of materials.

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