10M08DCU324A7G

The 10M08DCU324A7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) in a 324-LFBGA package optimized for embedded and automotive electronic designs. It combines a mid-range logic capacity with substantial on-chip RAM and a high I/O count to support complex control, interfacing, and data-aggregation tasks.

Designed for use across a wide temperature range and backed by AEC-Q100 qualification, this device targets applications requiring automotive-grade reliability, low-voltage operation, and surface-mount packaging in a compact 15 × 15 mm UBGA footprint.

Key Features

• Logic Capacity  8,000 logic elements to implement custom logic, control functions, and moderate-complexity finite state machines.
• On-Chip Memory  387,072 total RAM bits for buffering, lookup tables, and temporary data storage close to logic.
• I/O Density  246 user I/O pins to support dense sensor, actuator, and peripheral interfacing without external multiplexers.
• Power  Low-voltage core operation with a supply range of 1.15 V to 1.25 V for efficient integration with modern system power rails.
• Package & Mounting  324-LFBGA (supplier package: 324-UBGA, 15×15 mm) in a surface-mount form factor for compact PCB layouts.
• Automotive Qualification & Temperature Range  AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for designs that require automotive-grade reliability.
• Environmental Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Automotive control systems  Vehicle body electronics and control modules that require AEC-Q100 qualification and extended temperature operation.
• Sensor aggregation and preprocessing  High I/O count and on-chip RAM make the device well suited to gather, preprocess, and buffer multiple sensor inputs.
• In-vehicle networking and gateway functions  Ample I/O and programmable logic support protocol bridging, signal conditioning, and custom interface logic.
• Embedded control and sequencers  8,000 logic elements and embedded RAM enable real-time control, state machines, and customized peripheral management.

Unique Advantages

• AEC-Q100 Qualified: Automotive qualification ensures suitability for temperature- and reliability-sensitive vehicle electronics.
• High I/O Count: 246 I/O pins reduce the need for external multiplexing and simplify board-level interfacing to sensors and actuators.
• Balanced Logic and Memory: 8,000 logic elements paired with 387,072 bits of RAM provide a practical mix of compute and storage for embedded functions.
• Compact BGA Packaging: 324-LFBGA (324-UBGA, 15×15 mm) surface-mount package supports dense PCB layouts while maintaining thermal and electrical performance.
• Low-Voltage Core: 1.15–1.25 V supply simplifies integration with modern power domains and helps reduce overall system power.
• RoHS Compliant: Meets common environmental manufacturing requirements for global production.

Why Choose 10M08DCU324A7G?

The 10M08DCU324A7G delivers a practical combination of logic capacity, on-chip memory, and large I/O count in an automotive-qualified FPGA package. It is positioned for engineers who need a reliable, compact programmable device for vehicle electronics and other temperature-challenging embedded applications.

With Intel MAX® 10 FPGA technology in a 324-LFBGA form factor, this part is well suited to designs that require mid-range programmable logic, extensive interfacing, and the assurance of AEC-Q100 qualification for long-term deployment in demanding environments.

Request a quote or submit an inquiry to receive pricing and availability for the 10M08DCU324A7G. Our team can provide lead-time information and support to help you move your design forward.