10M08DCF256I7G

The 10M08DCF256I7G is an Intel MAX® 10 field-programmable gate array device supplied in a 256-LBGA package. It provides a mix of reconfigurable logic, on-chip RAM, and a high I/O count for embedded and industrial designs.

Built to MAX 10 series device specifications and specified as an industrial-grade part (-I7 speed grade), this FPGA targets applications that require moderate logic density, considerable on-chip memory, and broad I/O connectivity within a compact surface-mount package.

Key Features

• Core Logic — 8,000 logic elements to implement custom logic, control functions, and interface glue logic.
• On‑chip Memory — 387,072 total RAM bits for buffering, FIFOs, and data storage without external memory.
• I/O Density — 178 I/O pins to support multiple peripherals and high-pin-count system interfaces.
• Power Supply — Core voltage specified from 1.15 V to 1.25 V to match low-voltage FPGA system designs.
• Package — 256-LBGA (supplier device package: 256-FBGA, 17×17) in a surface-mount form factor for board-level integration.
• Industrial Grade & Temperature Range — Rated Grade: Industrial with operating temperature range of −40 °C to 100 °C for industrial deployment.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Reconfigurable logic and industrial temperature rating make it suitable for PLCs, motor drives, and factory automation controllers.
• High‑density I/O Systems — Use where many external interfaces or parallel signals are required, leveraging 178 I/O pins.
• Memory‑intensive Logic — On‑chip RAM (387,072 bits) supports buffering, packet handling, and other memory-heavy functions without immediate external memory.
• Embedded Custom Logic — Implement glue logic, protocol translation, and control state machines using 8,000 logic elements in a compact package.

Unique Advantages

• Industrial operating range: Rated from −40 °C to 100 °C, enabling use in harsh or temperature-variable environments.
• Balanced logic and memory resources: 8,000 logic elements paired with 387,072 RAM bits support mixed logic and data-handling tasks on-chip.
• High I/O capacity: 178 I/O pins provide flexibility for multi-sensor, multi-peripheral, or high-bandwidth interfacing.
• Compact BGA package: 256-LBGA (17×17) delivers high pin density in a small surface-mount footprint for space-constrained boards.
• Low-voltage core support: 1.15–1.25 V supply range aligns with contemporary low-voltage system designs.
• RoHS compliant: Meets common environmental restriction requirements for electronic assemblies.

Why Choose 10M08DCF256I7G?

The 10M08DCF256I7G combines a moderate logic element count with substantial on‑chip RAM and a high I/O count in a compact 256‑LBGA package, positioned for industrial applications that need reconfigurable logic and robust environmental performance. Its industrial grade and specified operating temperature range make it appropriate for deployed equipment that must tolerate wider temperature swings.

This device is well suited for engineers and procurement teams designing embedded systems that require a balance of logic, memory, and connectivity while minimizing board area. The MAX® 10 series implementation and documented device specifications support predictable integration into production hardware.

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