10M08DCU324C8G

The 10M08DCU324C8G is a MAX® 10 field programmable gate array (FPGA) IC in a 324-ball LFBGA package targeted for commercial applications. It integrates 8,000 logic elements, on-chip RAM, and a high-density I/O complement to support compact, programmable logic implementations in consumer and commercial systems.

Designed for surface-mount assembly, this device operates from a core voltage of 1.15 V to 1.25 V and across a commercial temperature range of 0 °C to 85 °C. The device datasheet provides detailed electrical characteristics, switching characteristics, configuration specifications, and timing information for system design and validation.

Key Features

• Logic Capacity — 8,000 logic elements for implementing custom logic, glue logic, and mid-density programmable functions.
• On‑Chip Memory — 387,072 total RAM bits to support buffers, FIFOs, and embedded data storage without external memory.
• I/O Density — 246 I/O pins to enable multiple peripheral interfaces and high pin-count connectivity in a single device.
• Package — 324-LFBGA (supplier package: 324-UBGA, 15 × 15 mm) optimized for compact boards and automated surface-mount assembly.
• Power — Core supply range of 1.15 V to 1.25 V to match low-voltage system power rails.
• Operating Range — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
• Mounting — Surface mount package type for standard PCB assembly flows.

Typical Applications

• Consumer and Commercial Electronics — Implement custom control logic, interface bridging, and peripheral management in compact, board-level designs.
• Communication Interfaces — Consolidate multiple interface functions and protocol bridging using the device’s high I/O count and programmable logic.
• Prototyping and Development — Use the reprogrammable fabric and on-chip RAM for iterative design validation and feature development.

Unique Advantages

• Balanced Logic and Memory: 8,000 logic elements paired with 387,072 RAM bits delivers flexible capacity for mid-density designs that require embedded storage.
• High I/O Count: 246 I/O pins enable multi‑interface and high‑pin-count implementations without external concentrators.
• Compact, Assembly‑Ready Package: 324-LFBGA (324-UBGA, 15×15 mm) provides a small footprint for space-constrained boards and standard surface-mount production.
• Low-Voltage Core: 1.15 V to 1.25 V core supply aligns with modern low-voltage power architectures to simplify power-supply design.
• Commercial Temperature Support: Rated 0 °C to 85 °C for deployment in typical commercial environments.
• RoHS Compliant: Meets lead-free and hazardous-substance requirements for global commercial products.

Why Choose 10M08DCU324C8G?

The 10M08DCU324C8G offers a practical combination of logic density, on-chip memory, and I/O capacity in a compact LFBGA package suitable for commercial applications. Its defined voltage range and temperature rating make it straightforward to integrate into standard consumer and commercial product designs where reprogrammable logic and embedded RAM reduce external component count.

This device is appropriate for engineers looking to consolidate interface logic, accelerate prototyping, or implement mid-density programmable functions while relying on comprehensive datasheet coverage of electrical, switching, and configuration specifications for design validation.

Request a quote or submit an inquiry to receive pricing and availability for the 10M08DCU324C8G and to discuss how it can fit your next design.