10M08DAF484I7P

The 10M08DAF484I7P is a MAX® 10 field programmable gate array (FPGA) IC designed for applications that require configurable logic, on-chip RAM and a large number of general-purpose I/O. This device provides 8,000 logic elements, 387,072 bits of embedded RAM and up to 250 I/O pins in a compact 484-ball FBGA package.

With a supply voltage range of 1.15–1.25 V and an industrial-grade operating temperature range of −40 °C to 100 °C, the device targets designs that need moderate logic capacity, substantial on-chip memory and robust thermal performance.

Key Features

• Core Logic  8,000 logic elements for implementing custom digital functions and state machines.
• On-Chip Memory  387,072 bits of total RAM to support buffering, FIFOs and small data-storage requirements without external memory.
• I/O Density  Up to 250 user I/O pins to support wide peripheral interfacing and parallel signal routing.
• Power  Nominal voltage supply range of 1.15–1.25 V for core power planning and system integration.
• Package  484-ball FBGA (23 × 23 mm) package providing a high I/O count in a compact surface-mount footprint.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployments in industrial and temperature-challenging environments.
• Mounting  Surface-mount package suitable for automated PCB assembly workflows.
• RoHS Compliant  Conforms to RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Industrial Control  Implement control logic, sequencing and I/O aggregation where industrial temperature tolerance and reliability are required.
• Custom Logic Acceleration  Offload application-specific processing or glue logic using the device’s 8,000 logic elements and extensive I/O.
• On-Board Memory and Buffering  Use the 387,072 bits of embedded RAM for data buffering, small caches or packet FIFOs without adding external memory.
• I/O Expansion and Interface Bridging  Leverage up to 250 I/O pins to consolidate multiple interfaces or provide wide parallel connections between subsystems.

Unique Advantages

• Balanced Logic and Memory: 8,000 logic elements paired with 387,072 bits of RAM supports a wide range of mid-density designs that need on-chip storage.
• High I/O Count in a Compact Package: 250 I/O pins within a 484-FBGA (23 × 23 mm) package maximize connectivity while minimizing PCB area.
• Industrial Temperature Qualification: Rated from −40 °C to 100 °C to meet the environmental demands of industrial applications.
• Controlled Core Voltage: A defined 1.15–1.25 V supply window simplifies power budgeting and core power sequencing.
• RoHS Compliant: Facilitates lead-free manufacturing and regulatory alignment for global production.

Why Choose 10M08DAF484I7P?

The 10M08DAF484I7P positions itself as a mid-density MAX® 10 FPGA option that combines a practical balance of logic capacity, substantial embedded RAM and a high I/O count in a compact 484-FBGA package. Its industrial temperature rating and controlled supply requirements make it suitable for designs where robustness and predictable power behavior are important.

This part is well-suited for engineers building industrial control systems, interface bridges, custom logic accelerators and embedded designs that require on-chip memory and dense I/O without moving to a larger footprint or external memory solutions. Selecting this device provides a clear specification set to plan power, thermal and PCB integration up front.

Request a quote or submit your pricing and availability inquiry today to evaluate the 10M08DAF484I7P for your next design.