10M08DFV81C8G

The 10M08DFV81C8G is an Intel MAX® 10 field programmable gate array (FPGA) in a compact 81‑UFBGA WLCSP package. It delivers reconfigurable logic capacity and on‑chip memory in a low‑voltage commercial‑grade device.

With 8,000 logic elements, 387,072 bits of on‑chip RAM and 56 I/O pins, this device addresses compact, I/O‑centric commercial embedded designs that require integrated programmable logic and memory in a small surface‑mount package.

Key Features

• Logic Capacity — 8,000 logic elements to implement custom digital logic functions and control logic in a single device.
• On‑Chip Memory — 387,072 total RAM bits for data buffering, state machines, and small memory structures without external RAM.
• I/O Count — 56 general‑purpose I/Os to interface with peripherals, sensors, and external devices.
• Low‑Voltage Core — Core voltage supply range from 1.15 V to 1.25 V to match low‑voltage system rails.
• Compact Package — 81‑UFBGA WLCSP (supplier package listed as 81‑VBGA, WLCSP, 4.5 × 4.4 mm) suitable for space‑constrained PCBs; surface mount packaging.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.
• Regulatory — RoHS compliant for lead‑free manufacturing environments.

Typical Applications

• Compact commercial embedded systems — Small WLCSP footprint and integrated RAM make the device suitable for space‑constrained boards requiring programmable logic.
• I/O expansion and interface bridging — 56 I/Os provide flexible connectivity for consolidating peripheral interfaces or implementing protocol conversion logic.
• Control and sequencing logic — 8,000 logic elements combined with on‑chip RAM support custom control, state machines, and timing logic in commercial products.

Unique Advantages

• Balanced logic and memory integration: 8,000 logic elements paired with 387,072 RAM bits reduce or eliminate the need for external memory in many designs.
• Small PCB footprint: The 81‑UFBGA WLCSP (4.5 × 4.4 mm) package enables high‑density board layouts and compact product designs.
• Flexible I/O resources: 56 I/Os allow direct connection to a wide range of peripherals and interfaces without additional interface chips.
• Low‑voltage operation: 1.15–1.25 V core supply aligns with modern low‑voltage power rails for reduced supply complexity.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for reliable performance in commercial environments.
• RoHS compliant: Meets lead‑free process requirements for compliant manufacturing flows.

Why Choose 10M08DFV81C8G?

The 10M08DFV81C8G combines a mid‑range logic capacity with substantial on‑chip RAM and a moderate I/O count in a compact WLCSP package, making it a pragmatic choice for commercial embedded systems that need reprogrammable logic without large board area or external memory. Its low‑voltage core and RoHS compliance simplify integration into modern, cost‑sensitive product designs.

This device is well suited for engineers and procurement teams specifying programmable logic for compact, I/O‑driven commercial products where board space, power rail compatibility, and integrated memory are priorities.

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