10M16DAF484A7G

The 10M16DAF484A7G is an Intel MAX® 10 field programmable gate array (FPGA) offered in a 484‑ball BGA package. It delivers a balanced combination of programmable logic, on‑chip memory, and high I/O density for embedded and automotive system designs.

This device is specified for automotive use with AEC‑Q100 qualification and an extended operating temperature range, making it a candidate for applications that require ruggedness, deterministic logic capacity, and flexible I/O integration.

Key Features

• Core Logic — 16,000 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
• On‑chip Memory — 562,176 total RAM bits available for data buffering, FIFOs, and local storage reducing reliance on external memory.
• I/O Density — 320 I/O pins to support multiple interfaces, sensors, and peripherals directly on the FPGA.
• Power — Core voltage supply range of 1.15 V to 1.25 V to match low‑voltage system domains.
• Package & Mounting — 484‑BGA (supplier device package 484‑FBGA, 23×23) in a surface‑mount form factor for compact board layouts.
• Automotive Qualification — Device Grade: Automotive; Qualification: AEC‑Q100.
• Operating Range — Specified for −40 °C to 125 °C operation to meet extended temperature requirements.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Automotive Control Systems — AEC‑Q100 qualification and −40 °C to 125 °C rating make the device suitable for in‑vehicle control and gateway functions where temperature resilience is required.
• Sensor Hubs and Aggregation — High I/O count and substantial on‑chip RAM enable aggregation, preprocessing, and buffering of multiple sensor channels.
• Embedded Control and Signal Processing — 16,000 logic elements and local RAM support custom control logic and deterministic signal handling in embedded systems.
• Protocol Bridging and I/O Expansion — Large I/O availability allows implementation of protocol converters and multi‑channel interface expansion on a single device.

Unique Advantages

• AEC‑Q100 qualified for automotive deployment: Built to the automotive qualification standard listed in the product data, enabling use in automotive electronic assemblies.
• Substantial on‑chip RAM: 562,176 total RAM bits reduce the need for external memory and simplify board design for buffering and local storage tasks.
• High logic capacity: 16,000 logic elements provide headroom for complex control, state machines, and custom accelerators within a single FPGA.
• Extensive I/O resources: 320 I/O pins support multi‑channel sensor interfaces, communications, and peripheral connectivity without additional multiplexing hardware.
• Compact BGA footprint: The 484‑FBGA (23×23) package enables a dense, space‑efficient board implementation while maintaining robust signal routing options.
• Low‑voltage core operation: 1.15 V to 1.25 V supply range aligns with modern low‑power system architectures.

Why Choose 10M16DAF484A7G?

10M16DAF484A7G combines a sizable logic fabric with abundant on‑chip RAM and high I/O density in a compact 484‑BGA package. The device's AEC‑Q100 qualification and wide operating temperature range provide a verified baseline for automotive and harsh‑environment applications that demand reliable programmable logic.

This MAX® 10 FPGA is aimed at designers who need an integrated, configurable solution to consolidate functions, reduce external components, and maintain performance over a broad temperature range. Its specification set supports scalable deployments where long‑term availability and platform consistency are important.

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