10M16DCF484I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 320 562176 16000 484-BGA |
|---|---|
| Quantity | 1,818 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 320 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 16000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 562176 |
Overview of 10M16DCF484I7G – MAX® 10 FPGA IC, 16,000 Logic Elements, 484‑BGA
The 10M16DCF484I7G is an Intel MAX® 10 field programmable gate array (FPGA) in a 484‑ball BGA package. It delivers 16,000 logic elements, 562,176 total RAM bits, and up to 320 I/O pins in a surface‑mount 484‑FBGA (23×23) footprint.
Designed as an industrial‑grade FPGA, this device supports a 1.15 V to 1.25 V core supply and an operating temperature range of −40 °C to 100 °C, offering a compact, memory‑rich programmable fabric for embedded and industrial designs.
Key Features
- Core Logic 16,000 logic elements for implementing combinational and sequential logic, state machines, and custom processing blocks.
- On‑chip Memory 562,176 total RAM bits to support buffering, LUT‑based memories, and small‑to‑moderate data storage directly on the FPGA.
- I/O Density Up to 320 I/O pins to support broad peripheral and interface connectivity in a single device.
- Power and Supply Core voltage range of 1.15 V to 1.25 V to match system power rails and enable predictable power budgeting.
- Package and Mounting 484‑BGA (supplier package: 484‑FBGA, 23×23), surface‑mount package that minimizes PCB area while providing high I/O count.
- Industrial Temperature Grade Specified for operation from −40 °C to 100 °C, suitable for a wide range of industrial environments.
- Regulatory Compliance RoHS compliant.
Unique Advantages
- High logic and memory integration: 16,000 logic elements combined with over half‑million RAM bits reduce the need for external memory and discrete logic, simplifying bill of materials.
- Wide I/O capability: 320 I/O pins enable multiplexed interfaces and multiple peripheral connections from a single FPGA package.
- Compact BGA footprint: The 484‑FBGA (23×23) package offers a dense pinout in a surface‑mount form factor, conserving PCB area for other system components.
- Industrial reliability: Rated for −40 °C to 100 °C operation, providing headroom for deployment in industrial environments.
- Predictable power domain: Narrow core voltage range (1.15–1.25 V) simplifies power‑supply design and helps with consistent power budgeting across production units.
- Standards‑friendly compliance: RoHS compliance supports use in products targeting global environmental regulations.
Why Choose 10M16DCF484I7G?
The 10M16DCF484I7G positions itself as a compact, memory‑rich industrial FPGA suitable for embedded and industrial system designs that require significant logic density and flexible I/O in a small package. Its combination of 16,000 logic elements, substantial on‑chip RAM, and up to 320 I/O pins makes it well suited for designs that need integrated programmable logic without large external memory subsystems.
With an operating range of −40 °C to 100 °C, surface‑mount 484‑FBGA packaging, and RoHS compliance, this device provides a balance of integration, environmental robustness, and predictable power characteristics for long‑term deployment and scalable development.
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