10M16DCF484I7G

IC FPGA 320 I/O 484FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 320 562176 16000 484-BGA

Quantity 1,818 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O320Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells16000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits562176

Overview of 10M16DCF484I7G – MAX® 10 FPGA IC, 16,000 Logic Elements, 484‑BGA

The 10M16DCF484I7G is an Intel MAX® 10 field programmable gate array (FPGA) in a 484‑ball BGA package. It delivers 16,000 logic elements, 562,176 total RAM bits, and up to 320 I/O pins in a surface‑mount 484‑FBGA (23×23) footprint.

Designed as an industrial‑grade FPGA, this device supports a 1.15 V to 1.25 V core supply and an operating temperature range of −40 °C to 100 °C, offering a compact, memory‑rich programmable fabric for embedded and industrial designs.

Key Features

  • Core Logic 16,000 logic elements for implementing combinational and sequential logic, state machines, and custom processing blocks.
  • On‑chip Memory 562,176 total RAM bits to support buffering, LUT‑based memories, and small‑to‑moderate data storage directly on the FPGA.
  • I/O Density Up to 320 I/O pins to support broad peripheral and interface connectivity in a single device.
  • Power and Supply Core voltage range of 1.15 V to 1.25 V to match system power rails and enable predictable power budgeting.
  • Package and Mounting 484‑BGA (supplier package: 484‑FBGA, 23×23), surface‑mount package that minimizes PCB area while providing high I/O count.
  • Industrial Temperature Grade Specified for operation from −40 °C to 100 °C, suitable for a wide range of industrial environments.
  • Regulatory Compliance RoHS compliant.

Unique Advantages

  • High logic and memory integration: 16,000 logic elements combined with over half‑million RAM bits reduce the need for external memory and discrete logic, simplifying bill of materials.
  • Wide I/O capability: 320 I/O pins enable multiplexed interfaces and multiple peripheral connections from a single FPGA package.
  • Compact BGA footprint: The 484‑FBGA (23×23) package offers a dense pinout in a surface‑mount form factor, conserving PCB area for other system components.
  • Industrial reliability: Rated for −40 °C to 100 °C operation, providing headroom for deployment in industrial environments.
  • Predictable power domain: Narrow core voltage range (1.15–1.25 V) simplifies power‑supply design and helps with consistent power budgeting across production units.
  • Standards‑friendly compliance: RoHS compliance supports use in products targeting global environmental regulations.

Why Choose 10M16DCF484I7G?

The 10M16DCF484I7G positions itself as a compact, memory‑rich industrial FPGA suitable for embedded and industrial system designs that require significant logic density and flexible I/O in a small package. Its combination of 16,000 logic elements, substantial on‑chip RAM, and up to 320 I/O pins makes it well suited for designs that need integrated programmable logic without large external memory subsystems.

With an operating range of −40 °C to 100 °C, surface‑mount 484‑FBGA packaging, and RoHS compliance, this device provides a balance of integration, environmental robustness, and predictable power characteristics for long‑term deployment and scalable development.

Request a quote or submit a purchase inquiry to evaluate the 10M16DCF484I7G for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up