10M40DCF256I7G

The 10M40DCF256I7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) designed for industrial-grade embedded logic functions. It provides a programmable logic fabric with 40,000 logic elements and 1,290,240 bits of on-chip RAM suitable for designs that require substantial on-chip memory and logic resources.

Key on-board characteristics include 178 device I/Os, a low-voltage core supply range of 1.15 V to 1.25 V, and an extended operating temperature range of −40 °C to 100 °C. The device ships in a 256-ball package and is intended for surface-mount board-level integration.

Key Features

• Logic Capacity  40,000 logic elements provide programmable logic resources for complex combinational and sequential designs.
• On-chip Memory  1,290,240 total RAM bits for embedded data buffering, FIFOs, and state storage without external memory.
• I/O Density  178 general-purpose device I/Os to support multiple interfaces and board-level connectivity requirements.
• Power Supply  Core voltage supply specified from 1.15 V to 1.25 V for predictable power provisioning and regulator selection.
• Industrial Grade & Temperature Range  Rated grade: Industrial; operating temperature range −40 °C to 100 °C for deployment in industrial environments.
• Package & Mounting  Package case: 256-LBGA; supplier device package listed as 256-FBGA (17×17). Surface-mount mounting type for compact board assembly.
• Standards Compliance  RoHS compliant.
• Documented Electrical and Timing Specifications  The device datasheet documents electrical characteristics, switching characteristics, configuration specifications, and timing parameters for design validation.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature rating and robust logic density make the device suitable for programmable control, sequencing, and signal processing in industrial systems.
• I/O-Intensive Systems  With 178 I/Os, the device fits applications that require multiple sensor, actuator, or peripheral interfaces on a single FPGA.
• On-Chip Memory-Dependent Logic  1.29 Mbit of embedded RAM supports designs that need substantial internal buffering, packet handling, or lookup tables without external memory.
• Compact Board-Level Integration  256-ball BGA package and surface-mount mounting aid high-density PCB implementations where board space is constrained.

Unique Advantages

• Substantial Logic Resource: 40,000 logic elements allow sizable programmable implementations without partitioning across multiple devices.
• High On-Chip Memory: 1,290,240 bits of RAM reduce dependency on external memory and simplify board-level design.
• High I/O Count: 178 device I/Os enable integration of multiple interfaces and peripherals directly to the FPGA.
• Industrial Temperature Rating: −40 °C to 100 °C supports deployment in industrial environments where extended temperature range is required.
• Compact Surface-Mount Package: 256-ball BGA package (256-LBGA / 256-FBGA 17×17) facilitates space-efficient PCB designs.
• RoHS Compliant: Meets lead-free and hazardous substance requirements for modern electronics manufacturing.

Why Choose 10M40DCF256I7G?

The 10M40DCF256I7G balances a high count of logic elements with substantial on-chip RAM and a large I/O complement in an industrial-grade FPGA package. Its voltage and thermal specifications support predictable power and environmental design considerations for board-level integration.

This device is suited to engineers and procurement teams specifying programmable logic for industrial and embedded systems that require consolidated logic, memory, and I/O capability in a compact surface-mount BGA footprint.

Request a quote or submit a pricing inquiry today to evaluate the 10M40DCF256I7G for your next industrial or embedded FPGA design.