10M40DCF484I6G

IC FPGA 360 I/O 484FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 360 1290240 40000 484-BGA

Quantity 81 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O360Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2500Number of Logic Elements/Cells40000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1290240

Overview of 10M40DCF484I6G – MAX® 10 Field Programmable Gate Array (FPGA) IC 360 1290240 40000 484-BGA

The 10M40DCF484I6G is an Intel MAX® 10 FPGA device offered in a 484-ball FBGA (23 × 23) package for surface-mount applications. It delivers a combination of programmable logic, on-chip RAM, and a high I/O count suited for industrial-grade embedded systems that require flexible, reconfigurable hardware.

Key attributes include 40,000 logic elements, 1,290,240 bits of on-chip RAM, 360 user I/O pins, and an industrial operating temperature range, making it appropriate where integration density and robust environmental performance are important.

Key Features

  • Programmable Logic  40,000 logic elements provide substantial capacity for combinational and sequential logic implementations.
  • On-Chip Memory  1,290,240 total RAM bits available for data buffering, state storage, and small embedded-memory functions.
  • High I/O Count  360 user I/O pins support complex interfacing and multiple parallel peripherals.
  • Package and Mounting  484-ball FBGA (23 × 23) in a surface-mount package for compact board integration and reliable soldered connections.
  • Power Supply Range  Core voltage supply between 1.15 V and 1.25 V to match target system power domains.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
  • Regulatory Compliance  RoHS-compliant to support lead-free manufacturing processes.

Unique Advantages

  • High integration density: 40,000 logic elements and over 1.29 Mbits of on-chip RAM reduce reliance on external components and simplify board-level design.
  • Extensive I/O capability: 360 I/Os enable broad peripheral connectivity and support for multi-channel interfaces without extra bridging logic.
  • Compact board footprint: 484-FBGA (23 × 23) package delivers a balance of pin count and small package area for space-constrained PCBs.
  • Industrial robustness: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
  • Deterministic power domain: Narrow core voltage range (1.15 V–1.25 V) facilitates predictable power design and supply selection.
  • Manufacturing-friendly: Surface-mount FBGA package and RoHS compliance align with modern PCB assembly and environmental requirements.

Why Choose 10M40DCF484I6G?

The 10M40DCF484I6G positions itself as a highly integrated FPGA option for engineers who need substantial logic capacity, on-chip RAM, and a large number of I/Os in a compact, surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for long-life embedded projects that require consistent operation across a wide temperature range.

Choose this device when your design requires tight integration of programmable logic and memory, significant external interfacing, and predictable power and thermal behavior. The combination of 40,000 logic elements, 1,290,240 bits of RAM, and 360 I/Os provides a versatile platform for complex embedded functions while simplifying BOM and board layout.

Request a quote or submit an RFQ to get pricing and availability for the 10M40DCF484I6G.

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