10M40DCF672C7G

The 10M40DCF672C7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA package. It provides a combination of high logic capacity, large on-chip RAM, and a high I/O count for commercial embedded designs.

With 40,000 logic elements, 1,290,240 bits of RAM and up to 500 I/O pins, this device is suited for applications that require dense programmable logic and extensive external interfacing while operating within commercial temperature and supply ranges.

Key Features

• Logic Capacity — 40,000 logic elements and approximately 2,500 logic blocks provide substantial programmable resources for custom digital functions.
• On‑Chip Memory — 1,290,240 total RAM bits for data buffering, state storage, and local memory functions without requiring external SDRAM.
• High I/O Count — Up to 500 programmable I/O pins to support dense peripheral and bus connectivity on complex boards.
• Package — 672‑FBGA (27×27 mm) surface‑mount package enabling a compact footprint for high‑pin‑count designs.
• Power and Supply — Core supply range of 1.15 V to 1.25 V to match system power architectures.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Assembly and Compliance — Surface‑mount package and RoHS compliant for standard commercial manufacturing flows.

Typical Applications

• Commercial Embedded Systems — Implement custom control, signal processing, or glue‑logic in space‑constrained commercial equipment that operates within 0 °C to 85 °C.
• High‑I/O Interfaces — Use the 500 available I/O pins to aggregate sensors, peripherals, or parallel/serial interfaces on a single FPGA platform.
• On‑Chip Memory‑Centric Designs — Leverage 1,290,240 bits of RAM for buffering, queues, and local memory needs without external memory components.
• Prototype and Development Platforms — Provide a high‑capacity, reprogrammable logic resource for validating system architectures and custom IP.

Unique Advantages

• Substantial Logic and Memory in One Device: 40,000 logic elements combined with over 1.29 Mb of RAM reduce the need for additional discrete logic and external memory.
• Extensive I/O for System Integration: 500 I/O pins enable direct connection to a wide range of peripherals and buses, simplifying board-level design.
• Compact, High‑Pin‑Count Package: 672‑FBGA (27×27) balances high pin density with a compact footprint for space‑constrained assemblies.
• Commercial‑Grade Operating Range: Specified for 0 °C to 85 °C, suitable for consumer and commercial environments.
• RoHS Compliant and Surface Mount: Supports standard lead‑free manufacturing and automated assembly processes.

Why Choose 10M40DCF672C7G?

The 10M40DCF672C7G targets designs that need a high degree of programmable logic, sizable on‑chip memory, and a large number of I/Os within a commercial temperature envelope. Its combination of 40,000 logic elements, 1,290,240 RAM bits, and 500 I/Os in a 672‑FBGA package lets engineers consolidate functions and reduce external components.

This part is appropriate for teams building commercial embedded systems, complex interface bridging, and prototype platforms that require substantial local memory and dense I/O. The device’s supply and package details are provided to support system‑level power and mechanical planning.

Request a quote or submit an RFQ to get pricing and availability for the 10M40DCF672C7G.