10M40DCF672C8G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 500 1290240 40000 672-BGA |
|---|---|
| Quantity | 813 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 500 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2500 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1290240 |
Overview of 10M40DCF672C8G – MAX® 10 Field Programmable Gate Array (FPGA) IC 500 1290240 40000 672-BGA
The 10M40DCF672C8G is an Intel MAX® 10 Field Programmable Gate Array supplied in a 672-BGA package. It delivers a large on-chip logic and memory footprint together with a high I/O count, packaged for surface-mount installation and targeted at commercial-temperature applications.
Key device attributes include 40,000 logic elements, 1,290,240 total RAM bits, 500 user I/Os, and a 1.15 V to 1.25 V supply range. These specifications support designs that require substantial integration and configurable I/O within a single FPGA device.
Key Features
- Logic Capacity 40,000 logic elements provide significant programmable logic resources for complex digital designs.
- On-chip Memory 1,290,240 total RAM bits available for buffering, state storage, and memory-intensive logic functions.
- High I/O Count 500 user I/Os to support broad external interfacing and dense system connectivity.
- Power Supported supply voltage range is 1.15 V to 1.25 V, enabling predictable power planning for embedded systems.
- Package & Mounting 672-BGA package; supplier device package listed as 672-FBGA (27x27). Device is surface mount for standard PCB assembly.
- Temperature & Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant to support lead-free manufacturing requirements.
Unique Advantages
- Substantial programmable logic: 40,000 logic elements allow integration of complex control, processing, or glue-logic into a single FPGA.
- Ample on-chip RAM: 1,290,240 bits of RAM reduce dependence on external memory for many buffering and local storage needs.
- Extensive I/O count: 500 user I/Os enable wide peripheral interfacing and flexible pin assignment for multi-channel systems.
- Compact BGA footprint: 672-ball BGA package (672-FBGA (27x27)) supports high-density PCB layouts while remaining surface-mount compatible.
- Low-voltage operation: Narrow 1.15 V to 1.25 V supply range simplifies power-rail design and planning.
- Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications and environments.
Why Choose 10M40DCF672C8G?
The 10M40DCF672C8G positions itself as a high-capacity MAX® 10 FPGA option that balances large programmable logic and memory with a very high I/O count in a compact BGA package. Its specifications make it suitable for commercial embedded designs that need extensive on-chip resources and flexible external interfacing.
Selecting this device offers designers a scalable, single-chip approach to consolidate logic, storage, and I/O, reducing board-level complexity while supporting predictable power and thermal planning within a commercial operating range.
Request a quote for the 10M40DCF672C8G to receive pricing and availability information for your design and procurement needs.

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