10M40DCF672C8G

IC FPGA 500 I/O 672FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 500 1290240 40000 672-BGA

Quantity 813 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O500Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2500Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1290240

Overview of 10M40DCF672C8G – MAX® 10 Field Programmable Gate Array (FPGA) IC 500 1290240 40000 672-BGA

The 10M40DCF672C8G is an Intel MAX® 10 Field Programmable Gate Array supplied in a 672-BGA package. It delivers a large on-chip logic and memory footprint together with a high I/O count, packaged for surface-mount installation and targeted at commercial-temperature applications.

Key device attributes include 40,000 logic elements, 1,290,240 total RAM bits, 500 user I/Os, and a 1.15 V to 1.25 V supply range. These specifications support designs that require substantial integration and configurable I/O within a single FPGA device.

Key Features

  • Logic Capacity 40,000 logic elements provide significant programmable logic resources for complex digital designs.
  • On-chip Memory 1,290,240 total RAM bits available for buffering, state storage, and memory-intensive logic functions.
  • High I/O Count 500 user I/Os to support broad external interfacing and dense system connectivity.
  • Power Supported supply voltage range is 1.15 V to 1.25 V, enabling predictable power planning for embedded systems.
  • Package & Mounting 672-BGA package; supplier device package listed as 672-FBGA (27x27). Device is surface mount for standard PCB assembly.
  • Temperature & Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant to support lead-free manufacturing requirements.

Unique Advantages

  • Substantial programmable logic: 40,000 logic elements allow integration of complex control, processing, or glue-logic into a single FPGA.
  • Ample on-chip RAM: 1,290,240 bits of RAM reduce dependence on external memory for many buffering and local storage needs.
  • Extensive I/O count: 500 user I/Os enable wide peripheral interfacing and flexible pin assignment for multi-channel systems.
  • Compact BGA footprint: 672-ball BGA package (672-FBGA (27x27)) supports high-density PCB layouts while remaining surface-mount compatible.
  • Low-voltage operation: Narrow 1.15 V to 1.25 V supply range simplifies power-rail design and planning.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications and environments.

Why Choose 10M40DCF672C8G?

The 10M40DCF672C8G positions itself as a high-capacity MAX® 10 FPGA option that balances large programmable logic and memory with a very high I/O count in a compact BGA package. Its specifications make it suitable for commercial embedded designs that need extensive on-chip resources and flexible external interfacing.

Selecting this device offers designers a scalable, single-chip approach to consolidate logic, storage, and I/O, reducing board-level complexity while supporting predictable power and thermal planning within a commercial operating range.

Request a quote for the 10M40DCF672C8G to receive pricing and availability information for your design and procurement needs.

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