10M40DDF256C8G

The 10M40DDF256C8G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) supplied in a 256-LBGA package. It delivers a combination of programmable logic, on-chip RAM, and a broad I/O count suitable for commercial embedded designs.

This device provides 40,000 logic elements, 1,290,240 bits of embedded RAM and 178 I/O pins, and is specified for surface-mount assembly with a supply voltage range of 1.15 V to 1.25 V and an operating temperature of 0 °C to 85 °C (commercial grade).

Key Features

• Logic Capacity  40,000 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  1,290,240 total RAM bits providing on-chip storage for FIFOs, buffers, and state machines.
• I/O Density  178 I/O pins to support multi-signal interfaces and peripheral connections in compact designs.
• Power and Voltage  Operates from a 1.15 V to 1.25 V core supply range to match system power architectures.
• Package and Mounting  256-LBGA (supplier package listed as 256-FBGA 17×17) in a surface-mount form factor for high-density board integration.
• Commercial Temperature Grade  Specified for 0 °C to 85 °C operation for commercial product environments.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Commercial embedded systems  Use the device where moderate to high logic capacity and on-chip RAM are required to implement control, signal processing, or interface logic within commercial products.
• Prototyping and development  Leverage the 40,000 logic elements and abundant I/Os to validate and iterate digital designs before production.
• Consumer and instrumentation interfaces  The combination of dense I/O and on-chip RAM supports user interfaces, data buffering, and peripheral bridging in consumer or instrumentation equipment.

Unique Advantages

• Substantial programmable logic: 40,000 logic elements enable implementation of sizable custom logic blocks without external glue logic.
• Large on-chip RAM: 1,290,240 bits of RAM reduce reliance on external memory for temporary data storage and buffering.
• High I/O count: 178 I/O pins simplify board-level routing for multi-channel interfaces and sensor/peripheral connectivity.
• Compact, surface-mount package: 256-LBGA (17×17 FBGA footprint) supports space-constrained PCB designs while maintaining thermal and mechanical compatibility with surface-mount assembly processes.
• Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliance for use in commercial products.

Why Choose 10M40DDF256C8G?

The 10M40DDF256C8G positions itself as a commercially graded, mid-to-high density MAX® 10 FPGA option that balances logic capacity, embedded memory, and I/O count in a compact 256-LBGA package. Its electrical and packaging specifications make it suitable for commercial embedded applications that require integrated logic and memory resources without increasing board count.

This device is a practical choice for designers and procurement teams targeting commercial product lines where predictable operating temperature, RoHS compliance, and a clear supply-voltage domain are important selection criteria.

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