10M40DDF672C8G

The 10M40DDF672C8G is an Intel MAX® 10 FPGA supplied in a 672-FBGA (27×27) package. It integrates up to 40,000 logic elements, 1,290,240 bits of on-chip RAM and provides 500 user I/O pins, making it suitable for compact designs that require significant programmable logic and I/O density.

Documented electrical and configuration information for MAX 10 devices includes operating conditions, switching characteristics, configuration specifications, JTAG timing parameters and remote system upgrade circuitry timing specifications. The device is supplied in a commercial grade (0 °C to 85 °C) and is RoHS compliant.

Key Features

• Logic Capacity — 40,000 logic elements to implement custom digital functions and control logic.
• On‑chip Memory — 1,290,240 total RAM bits for embedded data storage, buffering and state machines.
• I/O Density — 500 user I/O pins to support multiple peripherals, interfaces and parallel connections.
• Power Supply — Core supply voltage specified at 1.15 V to 1.25 V for device operation.
• Package — 672‑FBGA (27×27) surface‑mount package for high‑density board integration.
• Commercial Temperature Range — Rated 0 °C to 85 °C for commercial applications.
• Configuration & System Upgrade — Datasheet coverage includes configuration specifications, JTAG timing parameters and remote system upgrade circuitry timing specifications to support in‑system configuration and management.
• Compliance — RoHS compliant.

Typical Applications

• Custom digital logic — Implement application‑specific processing, glue logic and control functions with the device's 40,000 logic elements.
• High‑pin-count interfaces — Drive multiple parallel and serial interfaces using up to 500 user I/Os for board‑level integration.
• On‑chip buffering and state machines — Use the 1,290,240 bits of RAM to implement FIFOs, LUT RAM and local data storage for tight timing control.

Unique Advantages

• High logic and memory density: 40,000 logic elements combined with 1,290,240 RAM bits enable complex functions without external FPGA fabric.
• Broad I/O capability: 500 I/O pins allow consolidation of multiple peripherals and interfaces on a single device, reducing BOM complexity.
• Compact package: 672‑FBGA (27×27) provides a small footprint for space‑constrained PCBs while maintaining high pin count.
• Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial products.
• Configuration and upgrade support: Datasheet includes configuration, JTAG and remote system upgrade timing details to assist system integration and in‑field updates.

Why Choose 10M40DDF672C8G?

The 10M40DDF672C8G balances significant programmable logic capacity, substantial on‑chip RAM and a high I/O count in a compact 672‑FBGA package. It is positioned for commercial designs that need to integrate custom logic, handle multiple interfaces and support in‑system configuration or upgrades.

This device is suitable for engineering teams seeking a RoHS‑compliant, commercially rated FPGA offering detailed electrical and configuration documentation to support reliable system integration and development workflows.

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