10M40SAE144I7G

The 10M40SAE144I7G is a MAX® 10 Field Programmable Gate Array (FPGA) in a 144-LQFP exposed pad package. It provides 40,000 logic elements, 1,290,240 total RAM bits and up to 101 I/O for mid-density programmable logic integration.

Targeted for industrial-grade designs, this surface-mount FPGA supports a 2.85 V to 3.465 V supply range and an operating temperature of -40 °C to 100 °C, offering a combination of logic capacity, on-chip memory, and I/O density for embedded and control-oriented applications.

Key Features

• Core Logic 40,000 logic elements provide mid-density programmable logic suitable for a wide range of custom functions and glue logic.
• On-Chip Memory 1,290,240 total RAM bits available for data buffering, state machines, and temporary storage within the FPGA fabric.
• I/O Density Up to 101 I/O pins to support multiple interfaces, sensors, and external peripherals on a single device.
• Power Supply Operates from a 2.85 V to 3.465 V supply window to match common system power rails.
• Package and Mounting 144-LQFP exposed pad (supplier package: 144-EQFP, 20×20) in a surface-mount form factor for PCB assembly and thermal conduction through the exposed pad.
• Industrial Temperature Range Rated for -40 °C to 100 °C operation for use in industrial environments.
• RoHS Compliant Meets RoHS requirements for environmental and regulatory considerations.

Typical Applications

• Industrial Control Systems — Implement custom control logic, timing, and I/O aggregation in factory automation and process control equipment.
• Communication Interfaces — Provide protocol bridging, parallel-to-serial conversions, and interface adaptation for mid-density I/O systems.
• Embedded System Glue Logic — Consolidate discrete logic, timing, and buffering functions to reduce BOM and PCB area in embedded designs.
• Sensor Aggregation and Preprocessing — Collect and preprocess sensor data using on-chip memory and logic resources before passing to a host processor.

Unique Advantages

• Balanced Logic and Memory: 40,000 logic elements paired with 1,290,240 RAM bits allow designers to implement complex finite state machines, buffering and mid-sized data paths on a single device.
• High I/O Count: 101 I/O pins enable consolidation of multiple peripheral connections and reduce the need for external interface chips.
• Industrial Thermal Range: Specified -40 °C to 100 °C operation supports deployment in industrial environments where temperature resilience is required.
• Surface-Mount 144-LQFP Package: Compact 144-pin LQFP with exposed pad simplifies PCB layout and improves thermal dissipation compared with standard leaded packages.
• Flexible Power Integration: 2.85 V to 3.465 V supply compatibility eases integration into systems using common 3.3 V power rails.
• Regulatory Compliance: RoHS compliance supports environmental and supply-chain requirements.

Why Choose 10M40SAE144I7G?

The 10M40SAE144I7G delivers a practical balance of logic capacity, on-chip RAM, and I/O density in an industrial-grade, surface-mount 144-LQFP package. Its electrical and thermal specifications make it suitable for engineers designing embedded controllers, interface concentrators, and mid-complexity programmable logic solutions.

For teams seeking a commercially ready FPGA solution that combines integration, predictable thermal behavior via the exposed pad package, and a broad I/O complement, the 10M40SAE144I7G provides a clear platform for scalable designs and reduced board-level complexity.

Request a quote or submit your requirements to receive pricing and availability information for the 10M40SAE144I7G.