10M40DDF256I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 178 1290240 40000 256-LBGA |
|---|---|
| Quantity | 275 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 40 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 178 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2500 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1290240 |
Overview of 10M40DDF256I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC 178 1290240 40000 256-LBGA
The 10M40DDF256I7G is a MAX® 10 field programmable gate array from Intel designed for programmable-logic applications that require a balance of logic density, on-chip memory, and I/O capability. It integrates 40,000 logic elements and 1,290,240 bits of RAM to support custom digital functions and on-board buffering within a single device.
Packaged in a 256‑LBGA (supplier package: 256‑FBGA, 17×17 mm) and rated for industrial operation, the device supports 178 I/O pins and a core supply voltage range of 1.15–1.25 V, making it suitable for industrial-temperature embedded designs that require deterministic hardware programmability.
Key Features
- Programmable Fabric Provides 40,000 logic elements for implementing custom digital logic, state machines, and glue logic.
- On‑chip Memory Includes 1,290,240 total RAM bits to support data buffering, FIFOs, and small local memory structures without external RAM.
- High I/O Count 178 available I/O pins enable broad interfacing options for sensors, peripherals, and bus connections.
- Power Supply Core operates within a 1.15 V to 1.25 V supply range, allowing predictable integration with supporting power architectures.
- Industrial Temperature Range Qualified for operation from -40 °C to 100 °C, supporting deployment in industrial and other temperature-demanding environments.
- Package & Mounting 256‑LBGA package (supplier: 256‑FBGA, 17×17 mm) with surface‑mount mounting type for compact board integration.
- Compliance RoHS‑compliant manufacture for environmental and regulatory adherence.
Typical Applications
- Industrial Control Systems Use the industrial-grade temperature rating and programmable logic to implement deterministic control, I/O aggregation, and custom sequencing in factory automation and process control.
- Embedded Digital Processing Leverage the 40,000 logic elements and on‑chip RAM to realize bespoke data-paths, protocol handling, and glue logic in compact embedded platforms.
- I/O‑Dense Interface Modules Deploy the 178 I/O pins to bridge multiple peripherals, implement protocol translators, or expand interface capability on space-constrained PCBs.
Unique Advantages
- Dense Programmable Logic: 40,000 logic elements provide room to implement complex custom logic without external ASICs or CPLDs.
- Substantial On‑Chip Memory: 1,290,240 RAM bits reduce dependence on external memory for buffering and small data stores, simplifying BOM and board layout.
- Extensive I/O Capability: 178 I/O pins support flexible interfacing options for sensors, buses, and peripherals.
- Industrial Reliability: Rated for -40 °C to 100 °C operation, enabling use in temperature-challenging environments.
- Compact Surface‑Mount Package: 256‑LBGA (256‑FBGA, 17×17 mm) provides a high‑density footprint for space-sensitive designs.
- RoHS‑Compliant: Manufactured to RoHS standards to meet environmental requirements.
Why Choose 10M40DDF256I7G?
The 10M40DDF256I7G combines a sizable programmable fabric, significant on‑chip RAM, and a high I/O count in a compact 256‑LBGA package, positioned for industrial‑grade embedded designs that require on‑board logic flexibility and robust thermal performance. Its specified core voltage range and surface‑mount package allow integration into contemporary power and PCB designs while maintaining a small board footprint.
This device suits engineers and teams building custom digital interfaces, industrial controllers, and embedded systems that need scalable logic capacity, local memory resources, and reliable operation across a wide temperature window.
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