10M40DDF256I7G

IC FPGA/CPLD NV 178 I/O 256FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 178 1290240 40000 256-LBGA

Quantity 275 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time40 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O178Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2500Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1290240

Overview of 10M40DDF256I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC 178 1290240 40000 256-LBGA

The 10M40DDF256I7G is a MAX® 10 field programmable gate array from Intel designed for programmable-logic applications that require a balance of logic density, on-chip memory, and I/O capability. It integrates 40,000 logic elements and 1,290,240 bits of RAM to support custom digital functions and on-board buffering within a single device.

Packaged in a 256‑LBGA (supplier package: 256‑FBGA, 17×17 mm) and rated for industrial operation, the device supports 178 I/O pins and a core supply voltage range of 1.15–1.25 V, making it suitable for industrial-temperature embedded designs that require deterministic hardware programmability.

Key Features

  • Programmable Fabric  Provides 40,000 logic elements for implementing custom digital logic, state machines, and glue logic.
  • On‑chip Memory  Includes 1,290,240 total RAM bits to support data buffering, FIFOs, and small local memory structures without external RAM.
  • High I/O Count  178 available I/O pins enable broad interfacing options for sensors, peripherals, and bus connections.
  • Power Supply  Core operates within a 1.15 V to 1.25 V supply range, allowing predictable integration with supporting power architectures.
  • Industrial Temperature Range  Qualified for operation from -40 °C to 100 °C, supporting deployment in industrial and other temperature-demanding environments.
  • Package & Mounting  256‑LBGA package (supplier: 256‑FBGA, 17×17 mm) with surface‑mount mounting type for compact board integration.
  • Compliance  RoHS‑compliant manufacture for environmental and regulatory adherence.

Typical Applications

  • Industrial Control Systems  Use the industrial-grade temperature rating and programmable logic to implement deterministic control, I/O aggregation, and custom sequencing in factory automation and process control.
  • Embedded Digital Processing  Leverage the 40,000 logic elements and on‑chip RAM to realize bespoke data-paths, protocol handling, and glue logic in compact embedded platforms.
  • I/O‑Dense Interface Modules  Deploy the 178 I/O pins to bridge multiple peripherals, implement protocol translators, or expand interface capability on space-constrained PCBs.

Unique Advantages

  • Dense Programmable Logic: 40,000 logic elements provide room to implement complex custom logic without external ASICs or CPLDs.
  • Substantial On‑Chip Memory: 1,290,240 RAM bits reduce dependence on external memory for buffering and small data stores, simplifying BOM and board layout.
  • Extensive I/O Capability: 178 I/O pins support flexible interfacing options for sensors, buses, and peripherals.
  • Industrial Reliability: Rated for -40 °C to 100 °C operation, enabling use in temperature-challenging environments.
  • Compact Surface‑Mount Package: 256‑LBGA (256‑FBGA, 17×17 mm) provides a high‑density footprint for space-sensitive designs.
  • RoHS‑Compliant: Manufactured to RoHS standards to meet environmental requirements.

Why Choose 10M40DDF256I7G?

The 10M40DDF256I7G combines a sizable programmable fabric, significant on‑chip RAM, and a high I/O count in a compact 256‑LBGA package, positioned for industrial‑grade embedded designs that require on‑board logic flexibility and robust thermal performance. Its specified core voltage range and surface‑mount package allow integration into contemporary power and PCB designs while maintaining a small board footprint.

This device suits engineers and teams building custom digital interfaces, industrial controllers, and embedded systems that need scalable logic capacity, local memory resources, and reliable operation across a wide temperature window.

Request a quote or submit an inquiry to obtain pricing, availability, and technical support for the 10M40DDF256I7G. Include your intended quantity and any schedule requirements to expedite response.

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