10M40DCF672I6G

The 10M40DCF672I6G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 672‑ball BGA (27×27) package. It provides 40,000 logic elements, 1,290,240 bits of on‑chip RAM, and up to 500 general-purpose I/Os in a compact surface‑mount form factor.

Designed for applications that require dense programmable logic, substantial embedded memory, and a high I/O count, this industrial‑grade device supports a core supply range of 1.15 V to 1.25 V and an operating temperature range of −40 °C to 100 °C, with RoHS compliance.

Key Features

• Logic Capacity 40,000 logic elements provide a substantial resource pool for implementing complex programmable logic and control functions.
• Embedded RAM 1,290,240 total RAM bits available for on‑chip data buffering, state machines, and small memory structures.
• I/O Density Up to 500 I/O pins support extensive interfacing options for sensors, actuators, and external peripherals.
• Package 672‑FBGA (27×27) surface‑mount package for high‑density PCB implementations and reliable soldered connection.
• Power Core supply voltage specified at 1.15 V to 1.25 V for logic operation.
• Industrial Temperature Range Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
• Compliance RoHS status: Compliant.

Typical Applications

• Industrial automation Use the device’s industrial temperature rating and high I/O count to interface with sensors, actuators, and control buses in factory or process control equipment.
• High‑density I/O systems Leverage up to 500 I/Os for protocol bridging, multi‑port interfaces, and dense connector environments where many signals must be routed and managed.
• Embedded memory‑centric designs Employ the 1,290,240 bits of on‑chip RAM for buffering, packet queues, and deterministic data handling in real‑time systems.

Unique Advantages

• High logic and memory integration: Combines 40,000 logic elements with over 1.29 Mbit of RAM to consolidate functions that would otherwise require multiple devices.
• Extensive peripheral connectivity: The 500 I/O count enables flexible signal interfacing and reduces the need for external multiplexers or port expanders.
• Compact system footprint: 672‑FBGA (27×27) package supports dense board layouts while maintaining reliable surface‑mount assembly.
• Industrial robustness: −40 °C to 100 °C rating aligns the device with industrial deployment requirements for extended temperature operation.
• Low‑voltage core operation: 1.15 V–1.25 V supply range supports low‑power logic operation and modern power management strategies.
• Regulatory compliance: RoHS compliance simplifies environmental and end‑product compliance efforts.

Why Choose 10M40DCF672I6G?

The 10M40DCF672I6G positions itself as a high‑capacity, industrial‑grade MAX® 10 FPGA suitable for designs that need a balance of logic density, embedded RAM, and extensive I/O in a compact BGA package. Its specified voltage range and wide operating temperature make it appropriate for deployed systems where board space and environmental robustness matter.

This device is a fit for engineering teams building control systems, interface hubs, or memory‑dependent FPGA functions that require verified silicon from a recognized manufacturer and clear, documented electrical and timing specifications.

Request a quote or contact sales to discuss pricing, availability, and how the 10M40DCF672I6G can be integrated into your next design project.