10M50DCF256I6G

The 10M50DCF256I6G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) offered in a compact 256-LBGA package. It provides 50,000 logic elements, 1,677,312 bits of embedded RAM and 178 general-purpose I/O pins for dense, programmable logic designs.

Designed for industrial applications, this FPGA delivers a combination of logic capacity, on-chip memory and flexible I/O while operating over a wide temperature range and a low core-voltage window, enabling robust embedded and control system implementations.

Key Features

• Core / Logic  50,000 logic elements provide substantial programmable logic resources for complex finite state machines, data processing and control logic.
• On‑Chip Memory  1,677,312 total RAM bits enable sizeable on-device buffering, lookup tables and data storage without immediate reliance on external memory.
• I/O Density  178 I/O pins support broad peripheral interfacing and signal routing options for multi-channel systems.
• Power  Core supply operates from 1.15 V to 1.25 V, allowing designs to target low-voltage domains and optimize board-level power budgets.
• Package & Mounting  256-LBGA (supplier package: 256-FBGA, 17 × 17 mm) in a surface-mount form factor for compact board integration.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance  Device is RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Automation  Use the FPGA’s 50,000 logic elements, extensive I/O and industrial temperature rating to implement control logic, real-time processing and local interfacing in automation equipment.
• Embedded Control Systems  On-chip RAM and dense logic resources support embedded control tasks, protocol handling and deterministic processing within compact systems.
• High‑Density I/O Integration  178 I/Os enable aggregation and interface consolidation for multi-sensor or multi-peripheral applications requiring programmable routing and timing control.
• System Prototyping and Integration  The compact 256-LBGA package and surface-mount mounting make the device suitable for prototype boards and space-constrained production designs.

Unique Advantages

• Highly integrated logic and memory: 50,000 logic elements combined with 1,677,312 RAM bits reduce dependence on external components and simplify board-level architecture.
• Dense connectivity: 178 I/Os allow designers to centralize multiple interfaces and sensors into a single FPGA, lowering overall system complexity.
• Industrial robustness: Rated for −40 °C to 100 °C operation and listed as industrial grade to support deployment in harsher operating environments.
• Compact package: 256-LBGA (256-FBGA, 17×17) enables high-density integration in space-constrained designs while supporting surface-mount assembly.
• Low-voltage core operation: 1.15 V to 1.25 V supply window helps align the FPGA with modern low-voltage power domains.

Why Choose 10M50DCF256I6G?

The 10M50DCF256I6G positions itself as a high-capacity, industrial-grade FPGA option for designers who need substantial on-chip logic and memory in a compact package. Its combination of 50,000 logic elements, over 1.6 Mb of RAM and 178 I/Os supports consolidation of functions and streamlined board designs.

This device is suited to engineering teams developing embedded controllers, automation equipment and other industrial applications that require programmable logic, robust operating temperature range and surface-mount package compatibility. Its specifications support scalable designs where integration, I/O density and environmental resilience are priorities.

Request a quote or submit an inquiry to receive pricing and availability for the 10M50DCF256I6G and to discuss how it can fit your next design.