10M50DCF484C7G

The 10M50DCF484C7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) packaged in a 484-FBGA (23×23) surface-mount device. It delivers a combination of high logic density, on-chip memory, and a large I/O complement for configurable digital designs.

With 50,000 logic elements, 1,677,312 bits of on-chip RAM and 360 I/Os, this commercial-grade FPGA is suited to designs that require substantial programmable logic, integrated memory resources and dense external interfacing within a compact BGA package.

Key Features

• Logic Capacity — 50,000 logic elements for implementing complex, user-defined digital logic functions.
• On‑chip Memory — 1,677,312 total RAM bits to support buffering, FIFOs, and memory-intensive logic without external memory.
• High I/O Count — 360 I/Os to support extensive peripheral and bus interfacing requirements.
• Package and Mounting — 484-FBGA (23×23) package case (484-BGA) in a surface-mount form factor for compact board designs.
• Power — Core voltage supply range 1.15 V to 1.25 V to match system power-rail requirements.
• Commercial Temperature Grade — Rated operating temperature 0 °C to 85 °C and specified as Commercial grade (‑C7 speed grade).
• Configuration and System Management — Device documentation includes configuration specifications, JTAG timing, remote system upgrade circuitry timing, and user watchdog internal circuitry timing.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Custom digital logic and prototyping — Implement and iterate user-defined hardware functions using the device’s large logic element count and on-chip RAM.
• I/O‑intensive embedded systems — Use the 360 I/Os for dense peripheral connectivity, bus interfacing and signal multiplexing.
• Memory‑centric designs — Leverage 1,677,312 RAM bits for buffering, packet inspection, or state storage without relying solely on external memory.

Unique Advantages

• High logic density: 50,000 logic elements provide headroom for complex digital implementations within a single FPGA.
• Substantial on‑chip RAM: Over 1.6M bits of RAM reduce dependence on external memory and simplify board-level BOM.
• Dense external connectivity: 360 I/Os accommodate multiple interfaces and peripherals without additional I/O expanders.
• Compact surface‑mount BGA: 484-FBGA (23×23) package enables space-efficient PCB layouts for embedded products.
• Defined commercial operating range: Specified 0 °C to 85 °C rating and -C7 speed grade support consistent performance across typical commercial environments.
• Documented configuration and management: Datasheet coverage of configuration, JTAG, remote upgrade and watchdog timing helps streamline system integration and validation.

Why Choose 10M50DCF484C7G?

The 10M50DCF484C7G balances high programmable logic capacity, significant on-chip memory and a large I/O count in a compact 484-FBGA surface-mount package. Its electrical and timing characteristics are documented in the MAX® 10 device datasheet, covering configuration, JTAG and system upgrade timing to support reliable integration into configurable digital systems.

This FPGA is appropriate for engineers and procurement teams seeking a commercial-grade, high-density programmable device for embedded logic, I/O-rich designs and memory-heavy applications where consolidating logic and RAM on a single device reduces board complexity.

Request a quote or submit a parts inquiry to receive pricing, availability and purchasing information for the 10M50DCF484C7G.