10M50DCF484I7G

The 10M50DCF484I7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) configured in a 484-ball FBGA (23×23) surface-mount package. It delivers a high-density programmable logic resource with 50,000 logic elements, 1,677,312 total RAM bits, and 360 user I/Os.

Rated for industrial use and an operating range of −40 °C to 100 °C with a core supply of 1.15 V to 1.25 V, this device targets designs that require substantial on-chip memory, broad I/O connectivity, and compact package integration.

Key Features

• Logic Capacity  Provides 50,000 logic elements for complex combinational and sequential logic implementations.
• On‑chip Memory  Includes 1,677,312 total RAM bits to support buffering, FIFOs, and embedded data storage without external RAM.
• I/O Density  360 user I/Os enable high pin-count interfaces and flexible connectivity to peripherals and sensors.
• Industrial Grade  Specified as Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Power  Core voltage supply range of 1.15 V to 1.25 V for low-voltage system integration.
• Package & Mounting  484-FBGA (23×23) surface-mount package delivers a compact footprint for space-constrained boards.
• Environmental Compliance  RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• Industrial Control  Use in industrial control systems where wide temperature range and robust I/O count are required for interfacing with sensors, actuators, and field devices.
• I/O‑Rich Interfaces  Suitable for applications that require many parallel and serial interfaces, leveraging 360 user I/Os for peripheral connections and board-level routing flexibility.
• Memory‑Intensive Logic  Embedded applications that need significant on-chip RAM for buffering, packet processing, or data staging can take advantage of the 1,677,312 RAM bits.

Unique Advantages

• High Logic Density: 50,000 logic elements support sizeable custom logic implementations without immediate need for larger FPGA families.
• Substantial On‑Chip RAM: Over 1.6 million RAM bits enable internal data storage and reduce dependency on external memory components.
• Extensive I/O Availability: 360 user I/Os allow flexible system partitioning and direct interfacing to multiple peripherals and sensor arrays.
• Industrial Temperature Rating: −40 °C to 100 °C specification supports deployment in harsher environmental conditions common in industrial applications.
• Compact, Surface‑Mount Package: 484-FBGA (23×23) provides a high-density package option for space-constrained PCB layouts.
• RoHS Compliant: Conforms to environmental restrictions for reduced hazardous substances.

Why Choose 10M50DCF484I7G?

The 10M50DCF484I7G delivers a balance of high logic capacity, large on-chip memory, and extensive I/O in a compact industrial-grade package. As a member of the Intel MAX® 10 FPGA family, it offers a predictable integration path for designs that require significant programmable logic and memory while maintaining a small board footprint.

This device suits engineering teams and procurement groups building industrial embedded systems, high‑I/O interface boards, and memory‑intensive logic subsystems that require stable operating temperature performance and RoHS compliance.

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