10M50DCF672I7G

The 10M50DCF672I7G is an Intel MAX 10 field programmable gate array (FPGA) in a 672‑ball BGA package. It delivers a high-density programmable-logic fabric with 50,000 logic elements, abundant embedded RAM, and a large configurable I/O count designed for systems requiring industrial-temperature operation and surface-mount packaging.

This device is suitable for designs that require a compact, programmable solution with significant on-chip memory, wide I/O capability, and industrial-grade temperature tolerance.

Key Features

• Programmable Logic  50,000 logic elements provide substantial capacity for complex digital functions and custom logic implementations.
• Embedded Memory  1,677,312 total RAM bits for on-chip buffering, state storage, and data-path acceleration.
• High I/O Count  Up to 500 I/O pins to support wide peripheral connectivity and high-pin-count interfaces.
• Power Supply  Core voltage supply range of 1.15 V to 1.25 V to match system power-rail designs.
• Package & Mounting  672‑BGA package (supplier package: 672‑FBGA 27×27) in a surface-mount form factor for compact PCB layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Environmental Compliance  RoHS‑compliant to meet common environmental and assembly requirements.

Typical Applications

• Industrial Control  Use the FPGA’s 50,000 logic elements and industrial temperature range for programmable control, sequencing, and real‑time logic tasks in factory and process automation.
• Embedded Systems  Integrate high-channel I/O and on-chip RAM for embedded data processing, protocol bridging, and custom peripherals.
• Communications & I/O Aggregation  Leverage 500 I/O pins and substantial RAM to implement interface aggregation, protocol adaptation, and buffering functions.

Unique Advantages

• Significant Logic Capacity: 50,000 logic elements allow implementation of large custom logic blocks without external ASICs or discrete glue logic.
• Large On‑Chip Memory: 1.68 Mbit of RAM reduces the need for external memory for buffering and state storage, simplifying BOM and layout.
• Wide I/O Flexibility: 500 I/O pins enable direct connections to many peripherals and buses, minimizing external interface components.
• Industrial‑Grade Operation: −40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
• Compact, Surface‑Mount Packaging: 672‑BGA (27×27) delivers high pin density in a space-efficient footprint for modern PCB designs.
• Regulatory Readiness: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose 10M50DCF672I7G?

The 10M50DCF672I7G positions itself as a high-density, industrial-grade MAX 10 FPGA option that balances large programmable logic capacity, substantial embedded RAM, and a wide I/O count in a compact 672‑BGA surface-mount package. Its operating voltage range and −40 °C to 100 °C rating make it suitable for systems that require robust thermal performance and high integration.

This device is well suited for engineering teams looking to consolidate functionality, reduce external components, and deploy programmable logic in industrial and embedded applications where reliability and I/O density matter.

Request a quote or submit an inquiry for pricing and availability to move your design from concept to production with the 10M50DCF672I7G.