10M50DDF256I7G

The 10M50DDF256I7G is an Intel MAX® 10 FPGA in a 256-LBGA (256-FBGA, 17×17) surface-mount package. It delivers a high on-chip resource set including 50,000 logic elements, 1,677,312 bits of RAM, and up to 178 general-purpose I/O pins, all within a compact footprint.

Designed for industrial-grade applications, this device supports an operating temperature range of –40 °C to 100 °C and operates from a core voltage supply of 1.15 V to 1.25 V. The MAX 10 device family datasheet provides detailed electrical characteristics, switching and configuration specifications, and timing information for system-level integration and validation.

Key Features

• Core and Logic — 50,000 logic elements provide significant programmable logic capacity for glue logic, control functions, and custom digital processing.
• On-Chip Memory — 1,677,312 total RAM bits enable large buffering, state storage, and embedded memory functions without external RAM.
• I/O Resources — Up to 178 I/O pins support a wide variety of external interfaces and signal routing needs on compact PCBs.
• Package & Mounting — 256-LBGA (supplier package listed as 256-FBGA, 17×17) in a surface-mount form factor for space-efficient board integration.
• Power & Voltage — Core supply range of 1.15 V to 1.25 V for integration with low-voltage system rails.
• Industrial Grade Operation — Rated for –40 °C to 100 °C operation and specified as Industrial grade.
• Regulatory Compliance — RoHS compliant to meet environmental material requirements.
• Documented Family Specifications — Supported by the Intel MAX 10 FPGA device datasheet covering electrical, switching, configuration, and timing specifications.

Unique Advantages

• High logic density: 50,000 logic elements give designers room to implement complex finite-state machines, control logic, and custom datapaths on a single device.
• Substantial on-chip RAM: 1,677,312 bits of RAM reduce dependency on external memory for buffering and state retention, simplifying board design.
• Generous I/O count: 178 I/O pins allow flexible interfacing to sensors, peripherals, and other system components without extensive multiplexing.
• Industrial temperature capability: Operation from –40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact, manufacturable package: 256-LBGA (256-FBGA, 17×17) surface-mount package provides a balance of I/O density and board-space efficiency for production designs.

Why Choose 10M50DDF256I7G?

The 10M50DDF256I7G positions itself as a well-documented, industrial-grade MAX 10 FPGA option that combines substantial logic and memory resources with a high I/O count and compact LBGA packaging. Its specified operating temperature range and RoHS compliance make it suitable for industrial embedded designs that require reliable, long-term operation.

Engineers and purchasing teams seeking a single-device solution to consolidate digital logic, buffering, and interfacing will find the 10M50DDF256I7G offers a practical balance of integration and manufacturability, backed by Intel's MAX 10 device documentation for system-level validation.

Request a quote or submit an inquiry to check availability and pricing for 10M50DDF256I7G and to discuss how its specified resources and industrial operating range fit your next design.