10M50DDF672I7G

The 10M50DDF672I7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) in a 672‑BGA package designed for industrial-grade applications. It integrates a substantial logic fabric, abundant on-chip memory, and high-density I/O to support complex control, interface, and signal-processing tasks.

This device targets designs that require large programmable logic capacity (50,000 logic elements), extensive RAM resources, and a wide operating temperature range while operating from a 1.15 V to 1.25 V core supply.

Key Features

• Logic Capacity  Provides 50,000 logic elements and 3,125 logic blocks to implement complex custom logic, state machines, and data-paths.
• On‑Chip Memory  Total RAM of 1,677,312 bits to support large buffers, FIFOs, and embedded data storage without external memory in many use cases.
• High‑Density I/O  Up to 500 I/O pins for broad peripheral and interface connectivity, enabling multiple simultaneous device and sensor connections.
• Package  672‑FBGA (27×27 mm) BGA package for compact, high-pin-count board implementations; surface mount mounting type.
• Power  Core supply voltage range of 1.15 V to 1.25 V to match system power rails and FPGA power-management strategies.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C for applications that require extended ambient tolerance.
• RoHS Compliant  Manufactured to meet RoHS requirements for restricted substances.

Typical Applications

• Industrial Control  Use the device for programmable logic in motor control, PLC extensions, and factory automation where wide temperature range and robust I/O are required.
• Data Acquisition & Signal Conditioning  On‑chip RAM and abundant logic allow implementation of buffering, filtering, and real‑time pre-processing of sensor data.
• Communications & Interface Bridging  High I/O count supports multi‑protocol interface translation, protocol aggregation, and custom peripheral bridging at the hardware level.
• Embedded System Glue Logic  Implement custom control logic, timing, and peripheral glue in systems that benefit from programmable hardware integration.

Unique Advantages

• Large On‑Die Logic Fabric: 50,000 logic elements give designers room to consolidate multiple functions into a single device, reducing board-level complexity.
• Significant Embedded Memory: 1,677,312 bits of RAM reduce dependence on external memory for many buffering and data-management tasks, simplifying BOM and layout.
• High I/O Density: 500 available I/O pins accommodate complex sensor arrays, multiple interfaces, and parallel connections without multiplexing compromises.
• Industrial‑Grade Operation: Rated for −40 °C to 100 °C operation to meet the environmental demands of industrial deployments.
• Compact BGA Package: 672‑FBGA (27×27) provides high pin count in a compact footprint for space-constrained designs.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing standards for many global markets.

Why Choose 10M50DDF672I7G?

The 10M50DDF672I7G combines extensive programmable logic, sizable on‑chip RAM, and a high I/O count in an industrial‑rated package, making it suitable for embedded and industrial applications that require integration, deterministic hardware control, and thermal resilience. Its 672‑BGA package and surface‑mount form factor help conserve board area while providing the connectivity designers need.

This device is well suited for engineers and procurement teams looking to consolidate multiple discrete functions into a single FPGA, reduce external memory requirements, and maintain operation across a wide temperature range with RoHS compliance.

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