10M50SAE144C8G

The 10M50SAE144C8G is a MAX® 10 Field Programmable Gate Array (FPGA) supplied in a 144‑lead LQFP package with an exposed pad. It provides a high density of programmable logic and on‑chip memory in a commercial‑grade, surface‑mount form factor.

Key attributes include 50,000 logic elements, 1,677,312 total RAM bits and 101 general‑purpose I/O, combined with a 2.85 V to 3.465 V supply range and a 0 °C to 85 °C operating temperature window—making it suitable for a wide range of commercial embedded designs that require integrated logic and memory capacity.

Key Features

• Logic Capacity 50,000 logic elements provide substantial programmable resources for implementing complex digital functions.
• On‑Chip Memory 1,677,312 total RAM bits offer large embedded storage for buffering, state machines, and data path implementations.
• I/O Count 101 user I/O pins enable flexible interfacing with peripherals, sensors, and external buses.
• Power Supply Operates from 2.85 V to 3.465 V to match common system supply domains.
• Package and Mounting 144‑lead LQFP with exposed pad (supplier device package: 144‑EQFP, 20×20) in a surface‑mount format for compact PCB integration and thermal/ground connection through the exposed pad.
• Operating Range Commercial grade rating with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance Device is RoHS compliant.
• Logic Block Count 3,125 logic blocks for structured implementation of logic resources.

Unique Advantages

• High logic density: 50,000 logic elements let you consolidate complex functions on a single device, reducing external glue logic and board complexity.
• Large embedded RAM: 1,677,312 bits of on‑chip RAM reduce dependence on external memory for buffering and state storage, simplifying BOM and board routing.
• Generous I/O: 101 I/O pins provide flexibility for interfacing multiple peripherals, sensors, or buses without immediate need for expansion devices.
• Compact, serviceable package: 144‑lead LQFP with exposed pad and a 20×20 supplier package footprint supports dense PCB layouts while providing a thermal/ground contact point.
• Commercial readiness: Surface‑mount packaging and a 0 °C to 85 °C operating range align with standard commercial embedded system requirements.
• Compliance: RoHS compliance supports regulatory and environmental requirements for commercial electronics production.

Why Choose 10M50SAE144C8G?

The 10M50SAE144C8G positions itself as a commercial‑grade, mid‑to‑high density FPGA option that combines substantial logic capacity, significant on‑chip RAM, and a broad complement of I/O in a compact 144‑lead LQFP exposed pad package. Its supply voltage range and surface‑mount form factor make it straightforward to integrate into conventional commercial embedded designs.

This device is well suited for engineering teams seeking to consolidate functionality, reduce component count, and implement flexible, reconfigurable logic with on‑chip memory resources, while maintaining compliance with RoHS and standard commercial temperature requirements.

Request a quote or submit a pricing inquiry to receive availability and lead‑time information for the 10M50SAE144C8G.