10M50SCE144C8G

The 10M50SCE144C8G is a MAX® 10 Field Programmable Gate Array (FPGA) IC offering 50,000 logic elements and 1,677,312 bits of on-chip RAM in a compact 144-LQFP exposed-pad package. It provides a balance of logic density, memory capacity, and I/O count for commercial-grade embedded designs.

Built for surface-mount assembly and operating from a 2.85 V to 3.465 V supply at 0 °C to 85 °C, this device is suited to designs that require mid-range FPGA resources with a standardized package and RoHS-compliant materials.

Key Features

• Core Logic — 50,000 logic elements to implement moderate-density custom digital functions and control logic.
• On-Chip Memory — 1,677,312 total RAM bits to support data buffering, state machines, and scratchpad storage within the FPGA fabric.
• I/O Capacity — 101 user I/Os to connect peripherals, sensors, and external interfaces without external expander logic.
• Power — Operates from a 2.85 V to 3.465 V supply window, enabling compatibility with common 3.3 V system rails.
• Package & Mounting — 144-LQFP exposed pad (supplier package listed as 144-EQFP 20×20) optimized for surface-mount assembly and thermal conduction through the exposed pad.
• Temperature & Grade — Commercial grade operation from 0 °C to 85 °C for standard industrial and consumer environments.
• Environmental Compliance — RoHS compliant materials for restrictions on hazardous substances.

Typical Applications

• Embedded Systems — Implement custom control logic and data processing using up to 50,000 logic elements and significant on-chip RAM.
• Interface and Bridge Functions — Use 101 I/Os to aggregate and translate signals between subsystems without extra interface components.
• Prototyping and Development — Evaluate and iterate digital designs in a commercial-temperature FPGA package suitable for board-level evaluation.

Unique Advantages

• High Logic Density: 50,000 logic elements enable substantial digital integration on a single device, reducing external glue logic.
• Large On-Chip RAM: 1,677,312 bits of RAM support data buffering and local storage needs, lowering the requirement for external memory.
• Generous I/O Count: 101 I/Os allow flexible connectivity to multiple peripherals and system interfaces without additional multiplexers.
• Compact, Assembly-Friendly Package: 144-LQFP exposed-pad with surface-mount mounting supports streamlined PCB layout and thermal management.
• Commercial Temperature Range: Rated 0 °C to 85 °C to meet standard commercial application environments.
• Regulatory Compliance: RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose 10M50SCE144C8G?

The 10M50SCE144C8G provides a balanced solution for designs that require moderate FPGA logic capacity, substantial on-chip RAM, and a large number of I/Os in a standard 144-LQFP exposed-pad package. Its supply voltage range and commercial temperature rating make it suitable for a wide range of board-level designs where integration and compact packaging are priorities.

Choose this MAX® 10 device when you need a single-chip programmable solution that consolidates logic, memory, and I/O in a RoHS-compliant, surface-mount package for commercial applications.

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