10M50SCE144I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 101 1677312 50000 144-LQFP Exposed Pad |
|---|---|
| Quantity | 369 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 101 | Voltage | 2.85 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3125 | Number of Logic Elements/Cells | 50000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1677312 |
Overview of 10M50SCE144I7G – MAX® 10 Field Programmable Gate Array, 50,000 logic elements, 144-LQFP
The 10M50SCE144I7G is an Intel MAX® 10 field programmable gate array (FPGA) IC offering 50,000 logic elements and 1,677,312 total RAM bits in a surface-mount 144-LQFP exposed pad package. It targets industrial-grade designs that require on-chip logic capacity, integrated RAM, and a flexible I/O count.
With 101 I/O pins, a nominal supply range of 2.85 V to 3.465 V, and an operating temperature range of −40 °C to 100 °C, this device is specified for deployments that demand reliable operation across a broad temperature window.
Key Features
- Core Logic Capacity 50,000 logic elements (logic cells) provide substantial resources for implementing custom digital logic, glue logic, and hardware accelerators.
- Integrated RAM 1,677,312 total RAM bits for state storage, buffering, and small on-chip data structures without external memory.
- I/O Count 101 I/O pins support diverse interfacing needs and signal routing for mixed-signal or multi-peripheral systems.
- Power Supply Range Operates from 2.85 V to 3.465 V to match common system power rails and simplify board-level power distribution.
- Package 144-LQFP exposed pad surface-mount package (supplier device package: 144-EQFP 20 × 20) for compact integration and PCB assembly.
- Industrial Temperature Grade Rated for −40 °C to 100 °C operation, suitable for industrial environments and temperature-stressed applications.
- RoHS Compliant Conforms to RoHS requirements for environmental compliance in electronic assemblies.
Typical Applications
- Industrial Control Implement custom control logic, protocol bridging, and I/O aggregation for factory or process automation systems operating across a wide temperature range.
- Embedded Systems Provide programmable logic and on-chip RAM for embedded platforms requiring flexible hardware acceleration and compact packaging.
- Interface and I/O Consolidation Use the 101 I/O pins to consolidate multiple peripheral interfaces or to build custom front-end logic for sensors and actuators.
Unique Advantages
- High Logic Density: 50,000 logic elements enable significant on-chip functionality without immediate reliance on external programmable devices.
- Substantial On‑Chip Memory: 1,677,312 RAM bits reduce the need for external memory in many buffering and stateful applications.
- Broad Operating Temperature: −40 °C to 100 °C rating supports deployment in temperature-challenging industrial environments.
- Flexible I/O Count: 101 I/O pins accommodate diverse signal requirements and simplify board-level integration.
- Compact, Assembly‑Friendly Package: 144-LQFP exposed pad surface-mount package fits space-constrained PCBs while providing a solderable thermal pad for board-level thermal management.
- Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements for modern electronics.
Why Choose 10M50SCE144I7G?
The 10M50SCE144I7G positions itself as a robust, industrial-grade FPGA option within the Intel MAX® 10 family, combining substantial logic capacity, on-chip RAM, and a generous I/O complement in a compact 144-LQFP exposed pad package. Its supply voltage range and −40 °C to 100 °C operating specification make it suitable for designs that require stable operation across varying environmental conditions.
This device is well-suited for engineers and procurement teams building industrial control systems, embedded platforms, and I/O-centric applications that benefit from integrated memory, programmable logic, and a proven manufacturer ecosystem.
Request a quote or submit a sourcing inquiry to obtain pricing, lead times, and availability for the 10M50SCE144I7G.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018