10M50SAE144I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 101 1677312 50000 144-LQFP Exposed Pad |
|---|---|
| Quantity | 603 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 101 | Voltage | 2.85 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3125 | Number of Logic Elements/Cells | 50000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1677312 |
Overview of 10M50SAE144I7G – MAX® 10 FPGA, 50,000 Logic Elements, 144-LQFP
The 10M50SAE144I7G is a MAX® 10 Field Programmable Gate Array (FPGA) from Intel. It delivers a high-density programmable logic solution with 50,000 logic elements, 1,677,312 total RAM bits and 101 I/Os in a compact 144-LQFP exposed pad package.
Designed for industrial-class applications, the device supports a 2.85 V to 3.465 V supply range and an operating temperature range of -40 °C to 100 °C, providing a balanced combination of integration, I/O flexibility, and environmental resilience for demanding designs.
Key Features
- Logic Capacity — 50,000 logic elements with 3,125 logic blocks to implement complex digital functions and custom logic.
- Embedded Memory — 1,677,312 total RAM bits for on-chip buffering, FIFOs, and local data storage.
- I/O Resources — 101 I/O pins to support multiple parallel interfaces and mixed-signal front-end connections.
- Power — Operates from 2.85 V to 3.465 V supply rails for standard board-level power domains.
- Temperature Rating — Industrial operating range from -40 °C to 100 °C for use in harsher environments.
- Package & Mounting — 144-LQFP exposed pad, surface-mount device; supplier package specified as 144-EQFP (20×20).
- Environmental Compliance — RoHS compliant for lead-free manufacturing processes.
Typical Applications
- Industrial Control — Programmable logic for factory automation and process control where industrial temperature range and reliable I/O are required.
- I/O-Intensive Interface Bridging — Aggregation and protocol bridging using 101 I/Os for sensor arrays, communication endpoints, and peripheral hubs.
- On-Device Data Buffering — Use of 1,677,312 RAM bits for local buffering and data processing to reduce dependency on external memory.
- Compact Surface-Mount Systems — Dense 144-LQFP exposed pad package suited to space-constrained PCBs and surface-mount assembly workflows.
Unique Advantages
- High integration density: 50,000 logic elements enable consolidation of multiple discrete functions into a single programmable device.
- Significant on-chip memory: Over 1.6 million RAM bits support advanced buffering and state retention without immediate external memory.
- Flexible I/O count: 101 I/Os provide the interface headroom needed for parallel peripherals and multiple signal domains.
- Industrial-grade operation: Rated for -40 °C to 100 °C to match environmental requirements of industrial equipment.
- Surface-mount exposed pad package: 144-LQFP form factor (supplier 144-EQFP 20×20) supports compact PCB integration and assembly.
- RoHS compliant: Suitable for lead-free manufacturing and eco-conscious production processes.
Why Choose 10M50SAE144I7G?
10M50SAE144I7G brings together a large logic fabric, abundant on-chip memory, and substantial I/O capability in a compact, surface-mount exposed-pad package. Its industrial temperature rating and supply voltage range make it appropriate for embedded systems and control electronics that require programmable logic with environmental resilience.
As part of the MAX® 10 family from Intel, this device offers designers a scalable and integrated option for consolidating digital functions, implementing custom interfaces, and embedding data-handling logic directly on the PCB while adhering to RoHS manufacturing requirements.
Request a quote or submit a pricing inquiry to receive availability, lead-time, and ordering information for 10M50SAE144I7G.

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