10M50DDF484I7G

The 10M50DDF484I7G is an Intel MAX® 10 field-programmable gate array (FPGA) supplied in a 484-FBGA (23×23) surface-mount package. It provides a combination of programmable logic, on-chip RAM, and a substantial I/O count suitable for designs that require high logic density and significant local memory.

Key device characteristics include 50,000 logic elements, 1,677,312 bits of total on-chip RAM, 360 I/O pins, an industrial operating temperature range of −40 °C to 100 °C, and a core voltage supply between 1.15 V and 1.25 V.

Key Features

• Core Logic 50,000 logic elements provide large-scale programmable logic capacity for complex digital functions.
• On‑chip Memory 1,677,312 bits of total RAM allow for substantial data buffering, state storage, and implemented memory structures without external RAM.
• I/O Density 360 I/O pins support extensive peripheral and bus interfacing directly from the device.
• Package & Mounting 484-FBGA (23×23) package in a surface-mount form factor for compact PCB integration.
• Industrial Grade & Temperature Range Rated industrial grade with an operating temperature range of −40 °C to 100 °C for use in demanding environments.
• Supply Voltage Core voltage supply specified from 1.15 V to 1.25 V to match system power requirements.
• Compliance RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Industrial control and automation — The industrial grade rating and −40 °C to 100 °C operating range make the device suitable for control systems that require durable operation across harsh conditions.
• High‑density logic implementations — 50,000 logic elements support complex state machines, protocol handling, and custom data paths.
• Data buffering and local storage — 1,677,312 bits of on‑chip RAM enable local packet buffering, FIFO implementations, and temporary data storage without external memory.
• IO‑intensive systems — 360 I/O pins provide the pin count needed for multi‑lane interfaces, sensor arrays, or mixed-signal front-ends requiring many IO connections.
• Compact embedded platforms — 484-FBGA package and surface-mount mounting support space-constrained PCB designs.

Unique Advantages

• High logic capacity: 50,000 logic elements enable implementation of sizeable custom logic blocks and complex algorithms on a single device.
• Substantial on‑chip RAM: Over 1.6 million bits of RAM reduce dependence on external memory and simplify board-level BOM and routing.
• Extensive I/O: 360 I/O pins provide flexibility for connecting multiple peripherals and interfaces directly to the FPGA.
• Industrial reliability: Specified operating range of −40 °C to 100 °C supports reliable operation in industrial environments.
• Compact integration: 484-FBGA (23×23) surface-mount package balances high pin count with a compact footprint for densely packed boards.
• Regulatory readiness: RoHS compliance supports environmental and regulatory requirements for many end products.

Why Choose 10M50DDF484I7G?

The 10M50DDF484I7G delivers a blend of high logic density, significant on‑chip RAM, and robust I/O capability in a compact 484-FBGA surface‑mount package. Its industrial-grade rating and wide operating temperature range make it a practical choice where reliability across temperature extremes is required.

This device is suited to engineers and procurement teams specifying FPGAs for systems that need considerable programmable logic and memory close to the core logic, together with a high pin-out for interfacing—while maintaining a compact PCB footprint and RoHS compliance.

Request a quote or submit a purchase inquiry today to evaluate the 10M50DDF484I7G for your next high‑density, industrial FPGA design.