10M50DDF256C8G

The 10M50DDF256C8G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) device delivering 50,000 logic elements and 1,677,312 bits of embedded RAM in a compact 256-ball BGA package. It is a commercial-grade, surface-mount FPGA intended for designers who require reconfigurable digital logic and on-chip memory within a 0 °C to 85 °C operating range.

This device integrates substantial on-chip memory and I/O capability—178 I/O pins—while operating from a 1.15 V to 1.25 V core supply, making it suitable for space-constrained commercial applications that need programmable logic and flexible interfacing.

Key Features

• Core logic — 50,000 logic elements for implementing custom digital functions and complex logic designs.
• Embedded memory — 1,677,312 bits of on-chip RAM to support buffering, state storage, and intermediate data processing without external memory.
• I/O capacity — 178 general-purpose I/O pins to connect sensors, peripherals, and system interfaces directly to the FPGA fabric.
• Package and mounting — 256-LBGA package (supplier package: 256-FBGA, 17×17) in a surface-mount form factor for compact board layouts.
• Power requirements — Core voltage supply from 1.15 V to 1.25 V for the FPGA core.
• Commercial temperature and grade — Rated for 0 °C to 85 °C operating temperature and specified as commercial grade.
• Compliance — RoHS-compliant material status for environmental and regulatory considerations.
• Family documentation — Part of the Intel MAX® 10 device family; detailed electrical and timing specifications are provided in the MAX® 10 device datasheet.

Typical Applications

• Embedded control — Implement custom state machines, control logic, and peripheral glue logic where programmable hardware is required.
• User interfaces — Drive and manage display controllers, input handling, and intermediate signal processing using on-chip logic and memory.
• Signal conditioning and preprocessing — Use the FPGA fabric and embedded RAM to buffer and pre-process digital signals before passing them to downstream systems.
• Prototyping and development — Validate digital architectures and iterate hardware designs with reconfigurable logic in a commercial-temperature environment.

Unique Advantages

• High logic density: 50,000 logic elements enable implementation of sizeable digital systems without external ASICs.
• Substantial on-chip RAM: 1,677,312 bits of embedded memory reduce dependence on external memory for many buffering and state-storage needs.
• Ample I/O: 178 I/O pins provide extensive connectivity options for sensors, interfaces, and system peripherals.
• Compact packaging: 256-LBGA (256-FBGA, 17×17) surface-mount package supports dense PCB layouts and modern assembly flows.
• Commercial operating range: Specified for 0 °C to 85 °C to match common commercial electronic product requirements.
• RoHS compliant: Built to meet RoHS environmental requirements for reduced hazardous substances.

Why Choose 10M50DDF256C8G?

The 10M50DDF256C8G positions itself as a commercially-rated, mid-density FPGA offering a balanced combination of logic capacity, embedded RAM, and I/O in a compact 256-ball BGA package. Its specifications suit engineers who need reconfigurable logic and significant on-chip memory without expanding board area or adding external components.

This device is well-suited for commercial embedded designs, prototype platforms, and applications that require flexible digital logic and direct peripheral interfacing while operating from a 1.15 V–1.25 V core supply. As a member of the Intel MAX® 10 family, it is supported by the family-level documentation and electrical/timing resources provided in the MAX® 10 device datasheet.

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